Skip to Main Content

Ansys 2024 Product Release and Updates

Multiphysics to Multidomain

Ansys 2024 R2

Ansys 2024 R2 enables the transformation from multiphysics simulation to multidisciplinary, multidomain workflows. Extending the use of advanced numerical simulation across engineering disciplines, bridging the gap from multiphysics simulation to a digital engineering solution. Offering an unrivaled solution to transform complex challenges into competitive advantages, setting the standard for a true multiphysics, multi-domain engineering ecosystem.

2024 R2 Redefining High Fidelity Physics Simulation

Simplifying the Evolution to Multiphysics Simulation

By focusing exclusively on simulation, Ansys enhances our core simulation through strategic partnerships and diverse product offerings to take our solutions to the next level. Our flexible and open ecosystem that supports all Ansys technologies simplifies the evolution to multiphysics simulation.

2024 R2 Unrivaled Unified Multiphysics Solutions

Bridging the Gap from Multiphysics to Digital Engineering

Ansys enables the transformation to multidisciplinary, multidomain workflows by extending advanced numerical simulation across engineering disciplines. By exposing it in new ways to leverage cutting-edge technology like physics-based AI and the latest hardware and cloud offerings, it’s bridging the gap from multiphysics simulation to digital engineering.

2024 R2 Solve Real World Problems Without Limits

Transforming Complex Products into Competitive Solutions

Solving complex, real-world problems can only be achieved through a holistic view across a product’s life cycle, considering all system and environmental interactions. Ansys provides the infrastructure to support modern digital engineering design and an open ecosystem integrating seamlessly with an organization’s digital thread.

Ansys 2024 R2 Logo

Product Highlights

2024 R2 redefines the boundaries of product design by enabling customers to move beyond the limits of single-physics simulation to gain multidimensional insight into the performance of today’s complex products. R2 enhancements focus on accelerating run times, scaling capacity, enabling digital transformation, and providing hardware flexibility, making Ansys multiphysics simulations more accessible and powerful than ever before.

2024 R2 Discovery
3D Design

Ansys Discovery’s newest update significantly boosts geometry modeling speed, enhances simulation confidence, and debuts advanced GPU meshing for improved accuracy and reduced memory footprint. Model preparation is now 10X quicker, with improved workflows and tools simplifying complex tasks. The innovative GPU meshing ensures accurate fluid simulations, balancing detail capture and memory use. Automated bolt assessment and visualizations enhance simulation reliability, streamlining the design process for better, faster insights.

2024 R2 Additive magics integration

We are excited to announce the integration of Ansys's advanced simulation technology into Materialise Magics, a strategic partnership poised to transform metal additive manufacturing. This collaboration enhances product quality, reduces costs, and drives innovation by mitigating risks and predicting and addressing part deformation and thermal stress early.

2024 R2 AV Simulation
Autonomous Vehicle Simulation

Ansys 2024 R2 innovations expand the capabilities to address the critical safety needs of our customers. Improvements in the sensor’s domain address the challenges of enhanced radar digital twin IP protection for secure sharing and adaptive grid sampling to facilitate long-range object detection; AVxcelerate Autonomy introduces enhancements in the operation design domain (ODD) to enable more comprehensive scenario-based simulations, along with multiple UI ease-of-use improvements that help expand the scope of ADAS/AD validation.


Superior Multiphysics simulation needs superior connectivity. The 2024 R2 for the Connect collection builds on the capabilities required to construct best-in-class multiphysics workflows with our Ansys solvers. Ansys Connect offers the tools to quickly create and publish new workflows and manage simulation and material data traceably while offering robust AI-enabled optimization and analytic capabilities.

For complex systems our Ansys Model-Based Systems Engineering (MBSE) solutions can enhance the accuracy, efficiency and reliability of multiphysics simulation by providing clear, traceable links to simulation models to ensure the relevant systems requirements are met.

Digital Missions Engineering

Ansys Digital Mission Engineering (DME) offers exciting new capabilities focusing on expanding support for systems engineers across multi-domain mission simulation and engineering analysis.  With an emphasis on extending interoperability across the Ansys portfolio of products, 2024 R2 provides new capabilities for advanced system-level design and analysis, AI capabilities, and streamlined methods for connecting and collaborating across enterprise-wide organizations. DME tools deliver multi-domain mission modeling and simulation capabilities to support the needs of cross-disciplined engineering teams and systems integrators, enable collaboration, and operate consistently across the entire engineering lifecycle.   

Digital Twin

Ansys introduces Ansys TwinAI, a new addition to Ansys Digital Twin's product portfolio that seamlessly integrates the accuracy of physics models with insights from real-world data powered by cutting-edge AI/ML techniques. Ansys TwinAI now supports Reduced Order Models (ROMs) and integrates Ansys Design Language with new UI/UX improvements. Moreover, there are several improvements in hybrid analytics, handling of state-less FMUs, and ROM initialization. 

2024 R2 LF HF Electronics

Ansys Electronics continues to demonstrate its leadership in computational electromagnetics and multiphysics simulations. The 2024 R2 capabilities include:

  • New cooling methods and a new solution technique for electric machines
  • New EV powertrain design and simulation platform.
  • New solutions and improved workflows for the design of consumer electronic devices
  • New product for chips-to-system design and advanced packaging/3DIC
  • New product for large-scale radar and wireless networks
  • New mesh fusion for electrothermal analysis and enhanced mesh fusion performance for complex electromagnetics designs
2024 R2 Embedded Software
Embedded Software

This release brings enhancements to safety-critical software development, especially SCADE Suite. ARINC 661 compatibility is now updated to Supplement 9. Developers gain a Python API for programmatic connections between graphical panels and logic models. Moreover, AUTOSAR code generation and modeling achieves ISO 26262 ASIL D qualification. SCADE Suite benefits from a new Extension Manager. Scade One enhances user experience with block alignment, easy duplication, and automatic test harness generation features.

2024 R2 Fluids Fluent GPU update

Ansys Fluids 2024 R2 delivers updates that improve solver performance and provide new complex use case capabilities. The Fluent Multi-GPU Solver now supports AMD GPU cards, parametric studies, and expanded physics to accommodate new industry applications. Fluent Web Interface has new usability and productivity enhancements to improve user experience. Finally, advancements in fluid multi-physics workflows include expanded integrations between Rocky, Mechanical, Thermal Desktop, and STK.

Ansys CES Sustainability Industry

With a continued focus on how materials can drive sustainable design early, 2024 R2 adds analysis and comparison of a Bill of Materials (BoM) to quickly compare the environmental impact of materials chosen for different designs. Additional sustainability, temperature-dependent, high-temperature alloy, polymer, and electromagnetic materials are added across Material Libraries. Granta MI users can now subscribe to their favorite materials list in MI Material Gateways.

2024 R2 Optics

Ansys Optics 2024 R2 bridges the gap between theoretical design and real-world application, ensuring that systems can be designed, evaluated, and optimized with higher accuracy and reliability. Here are the key features:

  • Streamlined Data Exchange from Ansys Zemax OpticStudio to Ansys Speos
  • Enhanced Tolerancing Capabilities
  • Improved Light Guide Design for Automotive Lighting Systems
  • Enhanced Workflows for Photonic Integrated Circuits (PICs)
  • Enhanced Workflows for Modern Chip Design
Safety Analysis

The improved collaboration server in the Ansys Safety Analysis product collection offers a powerful collaboration feature. Your team can work concurrently on the same project, streamlining your safety-critical workflow.

The enhanced connectivity lets you seamlessly import models from various sources, such as Cameo and Codebeamer. The beta version of the generic SysML importer, loads SysML models based on scripts, opens up more possibilities.

Digital safety management (DSM) offers project templating with sophisticated updates and your safety management with project templates, nested hierarchies, and initial reports – all designed to boost team productivity and project efficiency.

2023 R2 Semiconductor

The semiconductor product line delivers significant advances in performance, speed, and capacity for advanced node chips, introducing new features for AMS design analysis and multi-die design's thermal and multiphysics analysis.

  • The SigmaAV capability revolutionizes voltage drop signoff by offering comprehensive local and global noise coverage
  • Reduced Order Models (ROM) enable a high-capacity analysis of chip and package systems with significantly reduced compute resources
  • New multiphysics enablement with a thermal flow for integrated silicon photonics
  • Ansys Totem-SC is 7x faster and offers 3x memory reduction
  • Constraint checker in Ansys ParagonX enables systematic verification of parameters against specification

Discover the cutting-edge features in Ansys Structures 2024 R2, designed to excel in One-Stop-Shop, Advanced Simulation Capabilities, and Interoperability Advantage. Enhancements include advanced Noise Vibration and Harshness (NVH) tools, new fluid penetration pressure load, and expanded multiphysics with LS-DYNA solvers. Seamless data integration is now possible with support for ABAQUS and LS-DYNA models and improved Rocky functionality. These updates, aligned with our Digital Engineering initiative, ensure that Ansys Structures remains the top choice for robust and innovative engineering simulation solutions.