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Ansys Icepak
电子组件冷却仿真软件

Ansys Icepak是一款用于电子热管理的CFD求解器。它可以预测IC封装、PCB、电子装配体、外壳和电力电子设备中的气流、温度和热传递。

Electronics Cooling & PCB Thermal Simulation and Analysis

Ansys Icepak provides powerful electronic cooling solutions that utilize the industry leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs) and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI).

  • Electromagnetics icon
    Unstructured, Body-fitted Meshing
  • Electromagnetics icon
    Comprehensive Thermal Reliability Solution
  • Electromagnetics icon
    High-fidelity CFD Solver
  • Electromagnetics icon
    Industry Leading Multiscale Multiphysics

Product Specs

Perform conduction, convection and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection.

  • MCAD and ECAD Support
  • Solar radiation
  • Parametrics and Optimization
  • Customization and Automation
  • Network Modeling
  • DC Joule Heating Analysis
  • Electro-thermal and Thermo-Mechanical
  • Extensive Libraries for Thermal
  • Liquid Cooling
  • Dynamic Thermal Management
  • Varying Flow and Power ROM

Creotech Instruments Creates Next-Generation Microsatellites with Multiphysics Simulation

Creotech implements leading-edge methodologies developed by the European Space Agency to design, assemble and integrate critical equipment that meets space standards.

Satellite Simulation
"Ansys multiphysics tools provide a highly integrated environment and have greatly improved the speed and affordability for developing our new HyperSat microsatellite platform."
— Tomasz Zawistowski Project Manager / HyperSat Creotech Instruments / Piaseczno, Poland

Repairing orbiting microsatellites is impossible due to extreme logistical challenges. Satellite engineers must ensure that equipment is space-proven and extremely reliable before launch. Creating individual satellite components generates high costs, requiring satellite integrators to meet stringent design requirements and satisfy high production process standards. Creotech Instruments’ use of multiphysics simulation effectively addresses these complex challenges.

July 2023

What's New

Solver and meshing improvements further boost the capabilities and simulation performance of Ansys Icepak.

Icepak Solving and Meshing simulation
Joule Heating Enhanced Meshing & Convergence

Available in Classic Icepack as well as AEDT Icepak (as Boundary-Based Mesh Refinement).

Icepak Solver Simulation
Major Improvements to Solver Performance

Up to 5.3x compared to Classic Icepak and 11.4x compared to AEDT Icepak in the 23 R1 release.


Icepak Applications

View all Applications
PCB and IC Packages

PCBs, ICs and IC packages

Ansys’ complete PCB design solution enables you to simulates PCBs, ICs, and packages and accurately evaluate an entire system.

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Electronics Reliability

Learn how Ansys integrated electronics reliability tools can help you  solve your biggest thermal, electrical and mechanical reliability challenges.

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Batteries

Ansys battery modeling and simulation solutions use multiphysics to help you maximize battery performance and safety while reducing cost and testing time.

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Electric Motors

Ansys electric motor design software progresses from concept design to detailed electromagnetics, thermal and mechanical analysis of electric motors.

Electronics Applications

预测电子装配体和印刷电路板的气流、温度和热传递

凭借以CAD为中心(机械和电气CAD)的多物理场用户界面,Icepak有助于解决当今电子产品和装配体中最具挑战性的热管理问题。Icepak使用复杂的CAD修复、简化和金属部分算法来减少仿真时间,同时提供经过实际产品验证的高精度解决方案。该解决方案的高精度源于高度自动化、先进的网格划分和求解器方案,可确保准确表示电子应用。

Icepak功能

 

主要特征

Icepak包括用于稳态和瞬态电子冷却应用的所有热传递模式——传导、对流和辐射。

  • Electronics Desktop 3D布局GUI
  • DC焦耳热分析
  • 多流体分析
  • 降阶流动和热
  • 热电冷却器建模
  • 封装特征描述
  • 集成式图形建模环境

IC功耗和电路板上的功率损耗是热分析的关键内容。

此外,您还可以进行热机械应力分析和气流分析,以选择理想的散热器或风扇解决方案。我们的集成式工作流程使您能够进行设计权衡,从而提高可靠性和性能。

Icepak用户可以在Ansys生态系统中轻松创建自动化工作流程,以完成对电迁移、介质击穿和多轴向焊点疲劳的多物理场分析。

使用产品包实现更智能的工作

热分析产品配对

通过这些产品配对改善无线通信、扩大信号覆盖范围并保持天线系统的连接功能、预测产品性能并建立安全的工作温度。

用于温度相关天线性能评估的热耦合电磁损耗(Icepak和HFSS)
确保使用天线的5G基础设施、汽车雷达、物联网设备和移动电子设备的热稳定性对于达到预期效果至关重要。视频通话、在线游戏或变化的环境条件等耗电活动会导致设备温度大幅波动。如果手机的电池变得过热,它可能会失去电量,甚至会造成安全问题。此外,高温会影响手机内的其它电子组件并影响射频天线的性能。手机与移动运营商、蓝牙或Wi-Fi的连接中断可追溯到热问题。在构建硬件之前,您可以通过使用Ansys工具仿真您的设计来预测这些问题。例如,电气工程师可以在Electronics Desktop中动态链接Ansys HFSS和 Ansys Icepak,以仿真天线的温度。根据电磁和热耦合解决方案,他们可以修改天线设计并预测天线效率以及产品的整体热和电磁性能。这些电磁和热仿真有助于改善无线通信、提高信号覆盖范围并保持天线系统的连接功能。
板级电热耦合(Icepak和SIwave)
即使温度略微升高也可能影响电子组件的性能和可靠性,从而导致系统级问题。 SIwave中的板级电源完整性仿真可以与Icepak热仿真相结合,以帮助全面了解PCB的电热性能。SIwave和Icepak可自动交换直流电源和温度数据,以计算PCB和封装内的焦耳热损耗,从而获得高度准确的温度场和电阻损耗分布。这些直流电热解决方案可让您管理设计产生的热量,并预测芯片、封装和电路板的热性能和安全工作温度。

Icepak资源和活动

特色网络研讨会

On Demand Webinar
Ansys Icepak Cooling Fan
Ansys 2023 R1: What's New in Ansys Icepak & Mechanical in AEDT

Learn about the latest updates and newest functionality in Ansys Icepak and Mechanical in AEDT.

On Demand Webinar
Ansys On Demand 网络研讨会
电力电子热管理

此次网络研讨会将展示Icepak的电力电子解决方案。

On Demand Webinar
Ansys On Demand 网络研讨会
用于温度循环的Ansys Icepak和Sherlock

本次网络研讨会将演示印刷电路板热建模的自动化流程。


案例研究

Ansys 案例研究

Creotech Instruments Creates Next-Generation Microsatellites with Multiphysics Simulation

Learn how Ansys multiphysics simulation helped Creotech create virtual prototypes of satellite components, modules and subsystems, enabling their engineers to analyze designs and verify their expected operation.

Ansys 案例研究

SuperGrid Institute Uses Ansys’ Solutions to Develop Power Electronics Technologies for Future Power Grids

SuperGrid Institute can efficiently design and simulate power converters thanks to the nonlinear and linear solvers in Ansys software.

Ansys案例研究东芝耦合

Ansys + Hewlett Packard Labs

Toshiba improves product reliability and decreases development time through electromagnetic–thermal–stress coupling.


白皮书和文章

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Application Brief

Thermal Solutions for 3D IC Packages and System

3D IC thermal analysis involves tiny features in chips, the package surrounding the chips, and the board or system connecting and surrounding the package. Since they are all thermally coupled, neglecting or oversimplifying one of the components can lead to inaccurate chip temperature prediction.


 


视频



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