Ansys RedHawk-SC is the proven industry leader for power noise and reliability signoff for your SoC designs. With a track record of thousands of designs in silicon, RedHawk-SC enables you to create high-performance SoCs that are still power efficient and reliable against thermal, electromigration (EM) and electrostatic discharge (ESD) issues for markets such as mobile, communications, high-performance computing, automotive and internet of things (IoT).
RedHawk-SC is a next-generation solution built on Ansys SeaScape, the world's first custom-designed, big data architecture for electronic system design and simulation. SeaScape provides per-core scalability, flexible design data access, instantaneous design bring-up, MapReduce-enabled analytics and many other revolutionary capabilities.
Chip-package-system co-analysis provides superior simulation accuracy and greater design insight than current independent analyses of chip and package.Learn More
Redhawk identifies thermal integrity and thermal-aware reliability issues, which can have a significant impact on power (leakage), IR, timing and electromigration (EM), especially in automobile applications.Learn More
Capacity and Performance
RedHawk offers you the capacity and performance to simulate designs having over 1 billion instances using advanced Distributed Machine Processing (DMP) techniques.Learn More
Silicon-Validated Signoff Accuracy
Provides foundry-certified accuracy for the reduced noise margins and higher voltage drops typical for FinFET designs.Learn More
Power Noise Impact on Timing
RedHawk helps you understand the impact of dynamic voltage drop on timing for clock and critical paths using full-chip-level timing-impact analysis in a SPICE-based sign-off simulation.Learn More
Integrity and Reliability of Advanced IC Packaging
Encapsulating chips within a 2.5-D or 3D package improves power, performance and form factor. Redhawk is qualified for the 2.5-D and 3D package reference flows.Learn More