Ansys RedHawk-SC is the proven industry leader for power noise and reliability signoff for your SoC designs. With a track record of thousands of designs in silicon, RedHawk-SC enables you to create high-performance SoCs that are still power efficient and reliable against thermal, electromigration (EM) and electrostatic discharge (ESD) issues for markets such as mobile, communications, high-performance computing, automotive and internet of things (IoT).

RedHawk-SC is a next-generation solution built on Ansys SeaScape, the world's first custom-designed, big data architecture for electronic system design and simulation. SeaScape provides per-core scalability, flexible design data access, instantaneous design bring-up, MapReduce-enabled analytics and many other revolutionary capabilities.

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SeaHawk計算引擎的底層大資料架構不僅具有超高的可擴展性,還能夠進行參數掃描和分析,市場現有工具難以望其項背。此外,SeaHawk還能線性擴展容量和性能,從而支援設計人員在進行封裝和系統設計時一併實現晶片可靠性目標,減少成本高昂的過度設計。

  • 設計內靜態和動態壓降分析
  • 設計內電遷移分析
  • 供電網路優化
  • 支援高度擴展性的彈性計算引擎
  • 為多域資訊提供靈活的資料分析
  • 縮短早期設計魯棒性檢查的周轉時間

Capabilities

  • Chip-Package Co-Analysis

    Chip-package-system co-analysis provides superior simulation accuracy and greater design insight than current independent analyses of chip and package.

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  • Thermal-Aware EM

    Redhawk identifies thermal integrity and thermal-aware reliability issues, which can have a significant impact on power (leakage), IR, timing and electromigration (EM), especially in automobile applications.

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  • Capacity and Performance

    RedHawk offers you the capacity and performance to simulate designs having over 1 billion instances using advanced Distributed Machine Processing (DMP) techniques.

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  • Silicon-Validated Signoff Accuracy

    Provides foundry-certified accuracy for the reduced noise margins and higher voltage drops typical for FinFET designs.

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  • Power Noise Impact on Timing

    RedHawk helps you understand the impact of dynamic voltage drop on timing for clock and critical paths using full-chip-level timing-impact analysis in a SPICE-based sign-off simulation.

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  • Integrity and Reliability of Advanced IC Packaging

    Encapsulating chips within a 2.5-D or 3D package improves power, performance and form factor. Redhawk is qualified for the 2.5-D and 3D package reference flows.

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