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High-Tech: Electronic Product Design Engineering

Accelerating Intelligent Connectivity with Simulation

Intelligent connectivity is transforming our world beyond recognition from autonomous vehicles to the Industrial Internet of Things. Simulation is critical to making these technologies a reality.

Simulation from Silicon to the City

For 5G, autonomous vehicles, smart products, homes, cities, and factories to become reality, the enabling electronics technologies must deliver unprecedented levels of reliability. With innumerable sensors, microprocessors, and communication components, engineers face immense product reliability and performance challenges. Engineering simulation plays a critical role in helping high-tech companies deliver innovative and reliable products that achieve and exceed their target performance, energy-efficiency, cost, and speed-to-market goals.

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    Optimize Power, Performance and Cost
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    Increase Product Reliability
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    Accelerate Innovation
Silicon to the city

Ansys simulations enable high speed High-Tech innovation

Win the Race to 5G and Beyond

With quality of service a key metric, engineers face critical challenges ranging from mmWave design to  beamforming, MIMO and signal and power integrity. Ansys’ comprehensive multiphysics solutions are the only way to win the race.

Lead in Digital Transformation, AI/ML and IIoT

Today’s intelligent products utilize artificial intelligence (AI), sensors and communications technologies to deliver comfort, convenience and efficiency. Simulation enables engineers to challenge conventional design wisdom and make the impossible possible.

Drive Intelligence and Automation Through IIoT

Multiphysics simulation solutions are critical to accelerate the development of reliable, high-performance, energy-efficient components and systems in the IIoT era.

Engineering Productivity and Innovation

Companies in the high-tech industry must innovate at speed to survive. Simulation led digital transformation enables companies to innovate faster, at lower cost and with fewer resources.

Applications

High tech electronics systems are the backbone for disruptive transformations occurring in industries ranging from mobility to energy, to the fourth industrial revolution and in silico healthcare. Ansys delivers high-tech electronics simulation applications spanning from the scale of silicon in semiconductor design and fabrication, to thermal and electronic reliability in packages and systems to electrically large environments such as cities.

Electric car lithium battery pack and power connections

5G

Engineers use Ansys simulation solutions to develop 5G technologies from devices to networks to data centers. Learn how simulation can help you solve difficult design problems and build your next generation of devices.

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Autonomy

Automation is driving progress across sectors, from factory robots to autonomous vehicles to machine learning and artificial intelligence technologies that drive automation itself. See why simulation is critical for autonomous technology to reach its full potential.

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Industrial IoT

The Internet of Things changed the way we live with smart devices. Now it’s changing the way we manufacture and produce nearly everything. Simulate what connects machines and processes to build digital twins based on real-world data.

晶片封裝

晶片封裝系統

利用 Ansys 完整的 PCB 設計解決方案,您能夠模擬 PCB、IC 和封裝並準確評估整個系統

電子可靠性

電子可靠性

瞭解 Ansys 整合式電子可靠性工具如何協助您解決最大的熱、電氣和機械可靠性挑戰。

天線設計和放置

天線設計和放置

天線設計的電磁模擬及其與整個系統的相互作用,能讓您評估天線的擺放位置、EMI/同址干擾等。

電磁干擾/相容性 (EMI/EMC)

電磁干擾/相容性 (EMI/EMC)

使用模擬將電磁干擾降至最低,可提供高效能、法令遵循且安全的電子系統,直至微晶片等級。

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Battery Simulation

Ansys battery modeling and simulation solutions use multiphysics to help you maximize battery performance and safety while reducing cost and testing time.

High-Tech: Innovation at the Speed of Light

This e-book introduces the five critical capabilities required to deliver the new design paradigm supported by real world examples.

transportation ADAS case study

WHEN WORLDS COLLIDE: THE NEW COMPETITIVE BATTLEGROUND.

To capture this opportunity and win the future of the system electronics and semiconductor industry, companies must innovate at the speed of light.

Many industries, ranging from consumer electronics to automotive and the military, are starting to design System-on-Chip (SoC) integrated circuits that are optimized for their own needs. At the same time, equipment designers are integrating multiple chips into a single package to create more complete and capable solutions. The battle for market share will be won and lost where these worlds come together: 3D Integrated Circuits (3D-IC).

As connectivity, digitalization and autonomy proliferate, the boundaries between industries are blurring at an unprecedented pace. Promising to unleash $3TN in global technology market spending, the new competitive battleground is to be found  where the system electronics and semiconductor worlds collide: The 3D Integrated Circuit System on Chip. 

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