Package on Board Simulation with 3-D Electromagnetic Simulation - White Paper

For many years, designers have taken into account the effect of package parasitics in simulation, from using simple first-order models, like ideal inductance + resistance, to more complex spice ladder networks and finally to full extraction of s-parameters of the package using 3-D electromagnetic simulators. For package plus PCB channels, currently the most common process is to extract the package and board independently as an s-parameter or broadband SPICE model and to combine both models in a circuit simulator. This approach has increasing limitations due to factors such as higher frequency of operation, increasing signal speed and more complex integrated devices.
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