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HFSS Regions in SIwave is a hybrid solution technique to obtain 3D full-wave accuracy for the S-parameters of critical nets on a printed circuit board. To demonstrate this feature, a very large PCB, 60 cm long and 42 cm wide, with 20 metal layers is used in ANSYS SIwave. High-speed differential pairs are identified on the PCB and region extents are created for the 3D discontinuities. Everything else is executed in an automated fashion in SIwave and the board is simulated with and without HFSS Regions. This whitepaper will help you develop a solid understanding of this feature.
A study of how Intel® Solid-State Drives on workstations running ANSYS* structural mechanics software can improve time to market through faster computing.
As demand grows for autonomous machines, only engineering simulation offers the means to launch
them into the marketplace quickly and cost-effectively - without sacrificing safety or reliability.
Autonomous machines - including vehicles, drones and robots - are capturing headlines and the
public's imagination, resulting in dramatic growth in market demand. However, developing these
autonomous systems is an engineering challenge without precedence. Whole new engineering
fields - such as artificial intelligence - are emerging to address this challenge, but time-tomarket
is short and the competition is intense. With human lives at stake, rigorous testing of these
systems is absolutely critical, but the sheer number of potential operating scenarios makes
comprehensive physical testing practically impossible. Only ANSYS engineering simulation
provides comprehensive solutions to manage this high degree of product complexity, replicate
thousands of operating scenarios, meet aggressive time and cost targets, and ensure product
safety. Via simulation, thousands of operating scenarios and design parameters can be virtually
tested with precision, speed and cost economy. As simulation plays a greater role in the
development of autonomous vehicles, drones and robots, we can expect to see these products
fast-tracked to keep pace with increasing market demand.
In designing electronics in today’s highly competitive markets, meeting requirements for electromagnetic compatibility (EMC) presents a major risk factor, especially since small windows of opportunity are critical to business success. ANSYS provides best-in-class tools and a proven methodology for accurately simulating EMI characteristics of electronic systems. This benefi ts development teams by providing insight to implement design modifi cations well before regulatory certifi cation submission.
This white paper describes eight best practices for cloud deployments that are fundamentally related to simulation data and end user access, licensing, HPC workloads, and business support.
This white paper debunks the leading misconceptions about HPC, and, in doing so, will assist engineering managers and directors as they make decisions regarding HPC. While dispelling these misconceptions, we will share resources and provide insight to help organizations steer around possible failure points as they consider HPC.