Power Noise Closure With Up to 10x Total Productivity Gain for Advanced Networking ASICs - Webinar

Challenges routinely faced by networking chip designers include extremely big capacity due to growing complexity of chips; more accurate modeling of the system and co-analysis at the top-level; chip thermal solution for chip power systems; comprehensive coverage of different modes of analysis in power integrity check; and timing impact annotation for jitter analysis and timing closure, just to name a few.

Join us for this webinar and discover how ANSYS RedHawk can help you to meet these challenges, with a focus on power integrity and reliability of advanced networking application-specific integrated circuits (ASICs). Learn how RedHawk’s capabilities in DMP (distributed machine processing), CPA (chip package analysis), CTA (chip thermal analysis) and thermal-aware EM (electromigration) analyses can provide a total productivity gain of up to 10x in networking chip design.
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