Power Noise and Reliability of High Speed IO Designs - Webinar

ANSYS Totem provides a comprehensive simulation framework for voltage drop, reliability (EM/ESD) and noise coupling analyses of analog, mixed-signal I/O designs. Modern chip manufacturers use engineering simulation to gain confidence in their designs and to help speed their new products to market.

Learn how Totem analyzes static and dynamic voltage drop at the IP or full-chip level to verify IP, not only during the design phase, but also during its integration at the SoC-level. Discover how Totem can validate your high-speed parallel I/O interfaces by simulating the complete I/O bank — together with the entire power distribution network for on-die, package, and PCB — to predict the effect of simultaneous switching noise (SSN) on signal transmission and on-chip jitter.
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