Multiphysics Simulation of a Printed Circuit Board - Webinar

When evaluating printed circuit board (PCB) designs, engineers must balance the requirements of multiple physics disciplines — electrical, thermal and mechanical — to produce PCB designs that contribute to long service life and reduced product failure.

This webinar examines how ANSYS multiphysics simulation allows engineers to analyze the overall reliability of a printed circuit board, simulating individual physical phenomena as well as the interaction between physics disciplines to improve overall product performance. Learn how power- and signal-integrity analysis can minimize crosstalk and evaluate the board’s power integrity; how thermal simulation can evaluate board temperatures and ensure that the device operates within an allowable temperature range; and how thermal−stress simulation can guarantee mechanical reliability.
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