Multiphysics Reliability Signoff Solution for Next-generation FinFET System on Chips

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Design for reliability is a key consideration for the successful signoff of next-generation FinFET system-on-chip (SoC) applications including autonomous vehicles, advanced driver assistance systems, 5G communication electronics, mobile and high-performance computing. Ansys provides comprehensive workflows with foundry-certified accuracy for multiphysics simulations across chips, packages and systems that capture the various failure mechanisms and provide signoff confidence for first-time silicon success.

Join us for this free webinar which provides a detailed analysis of Ansys’ multiphysics reliability signoff solution for next-generation FinFET SOCs.

  • Learn how Ansys addresses multiphysics reliability signoff challenges for advanced FinFET SoCs.
  • Discover how Ansys chip-package-system reliability signoff solutions address thermal, thermal-aware electromigration, failure in time and electrostatic discharge to create robust and reliable electronics systems.
  • Receive expert tips on using Ansys comprehensive workflows to capture failure mechanisms and deliver signoff confidence.

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