Chip-Package-Methodologies for Reliable, Cost-Optimized ICs for Automotive and Embedded Applications

The use of high-performance processors for Automotive and Embedded applications is continuing to rise. Unlike other applications, the ICs used for these markets must care about individual component-level power-performance-cost trade-offs in addition to compatibility with other IC’s and overall integration within a system environment. These types of designs must meet key targets such as Power Budgeting, Power Integrity, Electronic Interference Compatibility, Electric Discharge Immunity and Thermal susceptibility.

This presentation will explain how ANSYS-Apache technologies address Chip-Package-System analysis needs utilizing solutions such as PowerArtist, RedHawk, Totem, PathFinder, Sentinel and SIwave.
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