Benefits of a Chip-Package-System Simulation Workflow


Today’s electronic product development often requires chips that use advanced process technologies and/or packages, especially for high-performance computing (HPC), communications, mobile, high-end automotive and IoT applications. These chips require complete virtual prototyping using engineering simulation to ensure that they work in demanding operating conditions.
Learn how the Chip-Package-System solution from ANSYS can help you design compact, thermally and structurally efficient chips to meet these challenges. Discover how this holistic chip-package-system design methodology can save you development and manufacturing costs while providing the high reliability you need.


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