ANSYS Icepak 16.0: New Features and Enhancements - Webinar

ANSYS Icepak simulates thermal and fluid flow in ICs and PCBs, including all modes of heat transfer — conduction, convection and radiation — for steady-state and transient electronics cooling applications. Keeping electronic components cool is a key to preventing degradation of their performance.

Join us for this webinar to learn about new features added to ANSYS Icepak 16.0, including improvements in multiphysics coupling of electromagnetics and thermal simulation for increasing the fidelity of electronic designs. Discover how Icepak 16.0 can couple with other ANSYS electronics software solutions, such as ANSYS HFSS, ANSYS Maxwell, ANSYS Q3D Extractor, ANSYS Sentinel-TI and ANSYS SIwave for comprehensive analysis and design. The new and improved ECAD import option will also be discussed.