ANSYS Electronics Thermal Management Series: Icepak-MCAD Integration - Webinar

Modern electronics enclosures must handle ever-increasing heat densities due to the continued miniaturization and versatile functionalities of semiconductor devices. Reliability in electronics requires that hot spots be minimized. The engineering of thermal performance is no longer limited to the device and its primary cooling mechanism alone, but often involves all the remaining parts in the system — a neighboring package, a distant fan, or a chassis sheet metal.

View this webinar and receive an overview of ANSYS Icepak’s clean, organized and flexible geometry import from mechanical CAD software. Using a compute server as a design example, you will learn how engineers can efficiently study the thermal impact of a part on the system, and use this to identify the most suitable thermal model.