Accelerate Sign-off Convergence Through In-design Analysis - Webinar

With the advancement of Moore's Law and “More-than-Moore” technologies, System on Chip (SoC) designs continue to scale in size and complexity. A complete analysis solution must enable designers to make informed decisions on problems that are multivariate in nature (multi-physics, multi-domain), and also provide accurate analysis results while addressing increased tool capacity requirements. Leveraging in-design technologies can further help reduce design cycle time and costs associated w/ over-design or chip failure. Attend this webinar to learn how SoC designs can achieve faster power integrity and reliability sign-off convergence using accelerated and versatile in-design analysis, chip-package-system effects, and by leveraging distributed computing.
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