Find Electromigration Vulnerabilities on IC Packages Using SIwave Learn how to perform electromigration analysis with SIwave to predict mean time-to-failure for on-chip and advanced electronic packaging structures. View Back To Resource Library Request Now First NameFirst Name in EnglishLast NameLast Name in EnglishCompany or SchoolEmail Address Optin I want to receive updates and other offers from ANSYS and its partners. I can unsubscribe at any time. ANSYS Privacy NoticeCaptcha Product Interest 3D Design Exploration Cloud and Platform Services Electromagnetics Fluid Dynamics Materials Safety-Critical Embedded Software and Displays Semiconductor Power, Performance & Reliability Structural Mechanics System Simulation, Safety and Digital Twins Virtual Light Modeling Qualification Type utm_sourceutm_mediumutm_campaignutm_termutm_contentCampaign IdMember Status
