Find Electromigration Vulnerabilities on IC Packages Using SIwave Learn how to perform electromigration analysis with SIwave to predict mean time-to-failure for on-chip and advanced electronic packaging structures. View Back To Resource Library First NameFirst Name in EnglishLast NameLast Name in EnglishCompanyEmail Address Optin I want to receive updates and other offers from ANSYS and its partners. I can unsubscribe at any time. ANSYS Privacy NoticeCaptcha Product Interest 3D Design Exploration Cloud and Platform Services Materials Virtual Light Modeling Electromagnetics Safety-Critical Embedded Software and Displays Fluid Dynamics Semiconductor Power, Performance & Reliability Structural Mechanics System Simulation, Safety and Digital Twins Qualification Type
