Enabling Silicon-to-System Success with ANSYS Multiphysics Simulations

The new era of semiconductors will enable transformational products for artificial intelligence (AI), 5G, automotive, networking, cloud and edge compute applications. Ubiquitous connectivity, low latency and faster data rates will enable billions of smart devices. These devices will rely on advanced, low-power FinFET designs and state-of-the-art 3D-IC packaging technologies to deliver the required power, performance, area and reliability goals.

Multiphysics analysis is critical for designing these cutting-edge electronics systems to work reliably throughout their lifetime. ANSYS empowers customers with big data analytics, elastic compute scalability and multiphysics simulations to simultaneously solve power, thermal, variability, timing, electromagnetics and reliability challenges across the spectrum of chip, package and system to promote first-time silicon-to-system success.

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