Thermal Issues and Solutions for 3D ICs: Latest Updates and Future Prospects

Thermal issues have hindered the widespread adoption of 3D IC technology. Overcoming these issues has necessitated a concerted effort from all parts of the semiconductor community: architects, circuit designers, electronic design automation (EDA) vendors, foundries and packaging houses. In this presentation, professor Sung Kyu Lim, from Georgia Institute of Technology, discusses thermal issues and challenges for 3D ICs including detailed thermal analysis results of commercial-grade 3D IC designs targeting a wide range of applications. We analyze the root causes of thermal hotspots and their impact on power, performance and area (PPA), and discuss thermal-aware design and EDA solutions used for mitigation. We also address the need for multidisciplinary and multifaceted efforts.

Share:

I want to receive updates and other offers from Ansys and its partners. I can unsubscribe at any time. ANSYS Privacy Notice

Start a conversation with Ansys

Contact Us