Investigating the effect of solder geometry and board boundary conditions on solder thermal fatigue

Thermal fatigue is a major source of solder failure in surface mount electronic components, particularly in industries with high reliability applications such as aerospace, automotive and defense. For a company such as Continental Automotive, that designs and manufactures printed circuit board assemblies (PCBA) for these industries, it is critically important to understand how different designs can affect solder failure. Ansys Sherlock was chosen to model each of these scenarios for its ability to accurately generate representative models of complex geometry as well as provide predictions based on reliability physics.


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