BGA Failure Analysis
The client designs and manufactures industrial electric heaters, sensors and controllers. In an assembly process, they have experienced field failures on several boards and have tracked the failure to a specific ball grid array (BGA). They believed the failure was due to separation between some of the outer BGA balls (typically corner balls) and the board. However, what was not clear was whether the separation was related to soldering, contamination, cracking or some other issue. To get to the bottom of the issue, the client asked DfR Solutions to perform a destructive failure analysis to identify the root cause.