ANSYS Icepak - Brochure


ANSYS Icepak accurately predicts airflow, temperature and heat transfer for electronic and power electronic components and printed circuit boards. It also performs thermal analysis of system-level applications, and leverages the powerful computational fluid dynamics (CFD) solver, ANSYS Fluent, for evaluating conceptual designs and accessing data that would be either impractical or impossible with physical testing.


I want to receive updates and other offers from Ansys and its partners. I can unsubscribe at any time. ANSYS Privacy Notice

Start a conversation with Ansys

Contact Us