Taking the Heat - ANSYS Advantage - Article - V10 I1

A new approach to simplifying ECAD geometry makes it practical to predict warping and dynamics of PCBs under thermal loading. The potential for PCB failure due to thermal loading is escalating because of steadily increasing power dissipation combined with smaller board sizes. Multiphysics simulation is essential to calculate the DC current flow, determine the temperature field and predict the resulting thermal–mechanical stresses and deformation.


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