Simulation helps an electronic product operate safely at a higher ambient temperature.
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Keeping a smartphone from overheating is becoming more challenging as increasing numbers of transistors and devices are made to fit into a small, sleek design. Qualcomm engineers have developed a way to use simulation to create a smaller model of the power sources in a smartphone. This model can be solved in a fraction of the time of a full thermal analysis, so that they can look at more operating scenarios. The goal is to create a dynamic power management strategy to selectively direct power where it is needed and keep temperatures down.
Networking experts predict that, by 2021, 66 percent of all internet traffic will be used for high throughput services such as wireless docking, video streaming, cloud backup and virtual reality. Peraso Technologies enables users to cut the cord and go wireless by providing chipsets based on the emerging 802.11ad (WiGig) standard that delivers high-speed wireless throughput in a USB 3.0 stick form factor. Peraso engineers used ANSYS simulation software to solve thermal problems associated with packing high power transmitters into a tiny enclosure.
Smart Modular Technologies engineers leverage the ANSYS Electronics Desktop platform to reduce the time required to perform signal integrity analysis of a high-speed printed circuit from days to hours. By using unified electromagnetic, thermal and structural simulation, engineers developed a reliable adapter.
Electronics are pervasive in our world today. From electric machines to high-speed electronic devices to antennas and wireless communication, the demand continues to grow. However, designing innovative products to work reliably in the real world becomes more difficult with the need to reduce energy consumption, avoid interference with other devices and decrease development time. Leading companies leverage engineering simulation to quickly bring to market pioneering products that meet and exceed expectations.
Data center servers, storage and networking equipment communicate over copper and optical cable assemblies joined by ever-faster connectors. Samtec leverages a comprehensive suite of simulation software from ANSYS to design and optimize next-generation, high-performance interconnect solutions across the entire signal channel.
As electronics become more and more pervasive in our lives and businesses, the complexity of design increases exponentially, requiring advanced electronics simulation to develop the reliable products we can no longer flourish without.