Many important and complex simulations involve dirty and non-watertight geometries; creating a good quality mesh is always a challenging part of any such simulation. These complex meshes consume significant engineering time and effort in geometry preparation, largely involving extensive clean-up and repair. Now, ANSYS Fluent includes a fault-tolerant meshing workflow that can simplify and speed meshing for even the dirtiest geometries with no geometry preparation required.

本ウェビナーでは、ANSYS Forteを使用したフルサイクルGDIエンジンのシミュレーションのセットアップにおけるコツやヒントなどを紹介し、さらにANSYS EnSightでシミュレーション結果を可視化する方法について説明します。

Attend this webinar to learn how you can reduce simulation time on increasingly complex engineering challenges in today’s fast-paced globalized economy by incorporating high-performance computing (HPC) into your virtual product development.

Guest speaker Mike Hughes, who is the program director, digital engineering/transformation at Cummins Inc., will outline a credible path to the HPC power needed for ever-expanding engineering simulation demands. The views of solution provider Dell Technologies, who along with X-ISS provide an end-to-end HPC solution for ANSYS workloads, will also be presented.

A manufacturer of communication equipment supplied a client with tens of thousands of devices. The client began experiencing issues, reporting scores of thermal events and hundreds of field failures. The device supplier turned to ANSYS-DfR Solutions to investigate the root cause of the field failures and for corrective actions.

Plated through-holes (PTHs) and vias are widely deployed across the electronics industry for their ability to interconnect signal circuits at different printed circuit board (PCB) layers. But for many designers and engineers, vias and PTHs are sources of concern and difficulty when it comes to reliability: They are frequently the cause of open circuits on PCBs. Traditionally, the inconsistency of plating quality across manufacturers and the lack of robust material characterization make it challenging to develop models capable of predicting the reliability and manufacturability of these interconnects.

In this webinar, we will discuss the reliability challenges inherent in the utilization of PTHs and microvias. You will learn a methodology to analyze tens of thousands of interconnects on a PCB — and identify which are likely to fail — by simulating them under thermal loading using fine element modeling (FEM) and performing manufacturability and reliability analyses.

本ウェビナーでは、仮想プロトタイピングとその意味、マルチフィジックスシミュレーションについて説明し、さらに、ANSYSによるマルチフィジックスシミュレーションについて具体的な事例を交えながら紹介します。

種類を問わず、宇宙船の大気圏再突入について、共通の問題となるのは、宇宙船が大気圏を通過して帰還する際に高速で移動することから、ロケットの外面周囲に空力加熱源が生じるということです。本ウェビナーでは、方向の変更を伴いながら、地球の大気圏に突入していく、ミッション軌道のような領域について特に注目していきます。

Thermal-mechanical fatigue (TMF) is an engineering challenge across the aviation, power, transportation and electronics industries. In the transportation industry, components like in-cylinder, exhaust manifolds and turbochargers see high temperature and mechanical load variations that can lead to thermal-mechanical fatigue. In this webinar we will explore ANSYS’ state-of-the-art workflow for TMF. This includes the critical steps of capturing accurate transient thermal gradients and high-fidelity stresses and strains with the use of the latest nonlinear material models for heat resistant metal alloys. Life calculation techniques geared toward thermal-mechanical fatigue will also be discussed. Simulation of thermal-mechanical fatigue can reduce costly, time-consuming physical testing.

本ウェビナーでは、必要なときに、必要な場所に、ANSYSシミュレーションを実行するためのコンピューティング能力を提供するANSYS Cloudをご紹介します。ANSYS Cloudは、当社のデスクトップアプリケーションにビルトインされているため、デスクトップ上で処理するのと同じように、クラウド上で簡単に処理を行えます。

Tool designers frequently try to compensate distortions based on their experience and trial-and-error testing. This can work for simple geometries, but not for complex ones. The time and effort to manually compensate parts can be huge

Over the last decade, we have been advancing the capabilities of ANSYS Mechanical to address the unique challenges of composite finite element analysis (FEA) simulation. The ANSYS Composite Cure Simulation (ACCS) can quickly solve curing problems in cases where experience falls short.

In this webinar, you will learn how ACCS was used in the design of 170 molds for the Airbus A350 XWB, as well as for other applications.

Presenter: Douglas Weber-Steinhaus