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How Ansys Simulation Enables Cutting Edge Wind Technology Development

Wind energy is considered an important part of the global renewable energy strategy. Therefore, it is imperative that the development of these technologies matches the speed at which they are needed. 

Join Ansys and our customers as we explore how a simulation led approach enables the rapid development of their products in an industrial context.

Author: ANSYS, Inc. Type: Webinar Date:
Product Category: Structures, Systems, Fluids
Sub Industry: Wind Engineering, Wind Turbines


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Ansys Granta Pedigree and Validation of Materials Data

This brochure describes how materials data used in Ansys Granta products are collected, checked and validated for accuracy. This process ensures the pedigree of the materials data, which can have a major impact on the simulations in which they are used.

Author: ANSYS, Inc. Type: Brochure Date:
Product Name: ANSYS GRANTA MI, ANSYS GRANTA Selector, ANSYS Mechanical
Product Category: Materials, Structures
Industry: Materials and Chemical Processing


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Ansys Granta Pedigree and Validation of Materials Data

This brochure describes how materials data used in Ansys Granta products is collected, checked and validated for accuracy. This process ensures the pedigree of the materials data, which can have a major impact on the simulations in which they are used.

Author: ANSYS. Inc. Type: Brochure Date:
Product Name: ANSYS GRANTA MI, ANSYS GRANTA Selector
Product Category: Materials
Industry: Materials and Chemical Processing


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第6回: Ansys SPEOS 拡張カメラ

カメラは、自律型テクノロジーの大切な要素の 1 つです。この回では,Ansys SPEOS の拡張カメラセンサシミュレーション機能を使用して,ADAS/AD シミュレーションの精度を向上させる方法をご紹介します。さらに、新しいレンズインポーターを使用することで、オリジナルのシステムの知的財産を保護しながら、あらゆるイメージングシステムをAnsys SPEOSにインポートして光学解析を行う方法をご紹介します。

このwebinarで学べること:

  • EPP、2Dディストーション、フォーカス距離、DoFなど、カメラシステムのモデリングをさらに進化
  • Ansys SPEOSまたはZEMAX OpticStudioデザインをカメラ・シミュレーション用の簡易モデルに変換
  • レンズシステムの主要な光学特性を可視化
  • レンズ設計からカメラシミュレーションまで、新たなコラボレーションワークフローを構築

Author: アンシス・ジャパン株式会社 Type: Webinar Date:
Product Name: ANSYS SPEOS
Product Category: Optical


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基于Ansys平台的电机NVH仿真分析流程

电机NVH是指电机在运行过程中对外表现出的噪声、振动与声振粗糙度(Noise、Vibration、Harshness),其主要包括三个来源,即电磁噪声、机械噪声和空气动力噪声,在这三类噪声中,电磁噪声的频率相对来说处于高频段,尤其是与驱动器开关频率相关的电磁噪声的频率刚好处于人耳最敏感的噪声频率区间,其幅值基本上决定了电机NVH的整体指标,同时相较于其他两类噪声,电磁噪声更容易通过电机电磁和机械结构的优化设计进行有效的抑制,因此电机电磁振动噪声是我们重点关注的对象。

Author: Type: Article Date:
Product Name: ANSYS Maxwell
Product Category: Electronics
Sub Industry: Electrical and Electronics


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叶轮机械专题 | 如何高效准确地进行叶片颤振分析预测?

随着对叶轮机械产品性能要求的提高,叶尖切线速度越来越大、刚度越来越低,叶片颤振的可能性相比以往也大大增加,而我们知道叶片颤振会最终导致叶片断裂失效等严重事故。随着计算机仿真技术的发展,流固耦合分析方法已成为叶片颤振分析方法的主流,叶片的流固耦合分析中,需要对三维非定常流场和叶片的瞬态响应进行时间推进求解,而且叶片振动改变了流场边界,需要采用动网格技术对流场网格进行实时更新。

Author: Type: Article Date:
Product Name: ANSYS Mechanical, ANSYS CFD, ANSYS CFX


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嵌入式系统 | 基于SCADE模型的形式化方法

本文将重点阐述“基于SCADE模型的形式化方法”,做个通俗的比喻,形式化方法就是将程序抽象为一个数学公式,然后用严密的数学推理来证实或证伪该公式。在当下软件行业已经有众多测试手段的前提下,为什么还需要形式化方法呢?

Author: Type: Article Date:
Product Name: ANSYS SCADE Suite


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Roughness Effect on Next-Gen Cu Interconnects

In the past, for computation of electrical parameters of on-chip and chip-to-chip interconnects, it has been usually assumed that the conductor surface is homogeneous with smooth outer surfaces. However, copper (Cu) suffers from surface roughness that aggravates conductor losses in high speed interconnects. The delay in interconnects depends mainly on the interconnect parasitics, which would therefore be aggravated due to surface roughness. This leads to reduced bandwidth and higher latency.

The goal of this webinar is to address the roughness-related effects on performance of on-chip and chip-to-chip Cu interconnects. Topics include:

  • Analytical models for extracting line parasitics (RLC p.u.l.) for deeply scaled on-chip interconnects and chip-to-chip interconnects with rough surfaces
  • Analytical models for the computation of resistivity and mean free path of on-chip interconnects at current and advanced technology nodes (i.e., 45nm, 22nm, 13nm, 7nm)
  • Signal integrity analysis using eye diagrams at different bit rates to find the increase in frequency dependent losses due to surface roughness
  • Computational overhead (simulation time, physical memory, matrix size, number of tetrahedrons) incurred for simulating on-chip and chip-to-chip Cu interconnects at different values of roughness and technology nodes.
  • The relationship between surface roughness and various performance metrics such as delay, EDP, BWD, and insertion loss.
  • A comprehensive analysis of the impact of interconnect surface roughness on the energy-budget in networks on chips (NoCs)

Author: ANSYS, Inc. Type: Webinar Date:
Product Category: Semiconductors


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Accelerate Post-Processing with Ansys EnSight

Analyze, visualize and communicate your simulation data with Ansys EnSight. Engineers use this powerful, general purpose post-processing tool to gain new design insights and then clearly and effectively sell their recommendations. Flexible EnSight can read and visualize data from most simulation tools — including Ansys solutions and other vendors.

EnSight handles simulation data from a wide range of physics from fluids, structures, particles, crashes and more. With EnSight, you can create and communicate clear, appealing, high-resolution simulation results on datasets that were previously thought to be too big to handle.

Topics Covered:

  • Animation strategies
  • Advanced features
  • Report generation
  • Automation & Scripting

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS EnSight
Product Category: Fluids


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Fluent Meshing in 15 Minutes: Automotive External Aero

Attend this webinar to learn how Ansys Fluent can accelerate the meshing and solve time for automotive external aerodynamics applications. There will be a live demonstration showcasing:

  • CAD import to volume mesh generation
  • User-friendly task-based workflows
  • How to customize and save your workflow
  • Advanced meshing technologies
  • Efficient parallel meshing

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Fluent
Product Category: Fluids


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