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GRANTA EduPack Overview

ANSYS GRANTA EduPack helps materials educators engage students in materials topics and supports their learning throughout the engineering curriculum. Relied on by over 1,000 universities and colleges worldwide, EduPack’s data, tools and associated student and teaching resources provide educators with a dynamic way to enliven their teaching and keep up to date.

Author: ANSYS, Inc. Type: Brochure Date:
Product Name: ANSYS CES EduPack
Product Category: Academic, Materials


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ANSYS 2020 R1 - HFSS Product Update Webinar

Join us to learn about the new capabilities available in ANSYS HFSS 2020 R1. The latest release has powerful new features for the design of microwave, RF and high-speed electronic devices, including finite antenna array enhancements; ANSYS HFSS SBR+ creeping wave physics for accurate antenna placement simulations; enhanced simulation flows; and HFSS solver speed improvements.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS HFSS
Product Category: Electronics


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Going Beyond Functional Safety: SOTIF Analysis of Automotive Systems

In this webinar, learn how Ansys medini analyze supports the new SOTIF standard for road vehicles (ISO/CD 21448), and aids in the systematic identification, evaluation and subsequent risk mitigation of hazards caused by functional insufficiencies.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS medini analyze
Product Category: Systems


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Ensuring Accurate Material Properties for Simulation with Digital Image Correlation (DIC)

The coefficient of thermal expansion (CTE) is one the most important factors affecting solder fatigue. Thus, knowing the accurate CTE for your materials is essential when designing electronics and selecting parts. With increasingly complex materials and architectures being used in complicated simulations, digital image correlation (DIC) can help you to ensure the accuracy of those simulations. DIC is especially critical for capturing the behavior of electronic components and circuit boards when simulating their response to thermal, thermomechanical and mechanical loads.

In this webinar you’ll learn how DIC material testing can be used to accurately measure the CTE of components and boards, as well as how the technique can be used to identify the glass transition temperatures of polymeric materials like pottings, underfills and coatings, which are often within the operating temperature range of electronics.

Author: ANSYS, Inc. Type: Webinar Date:
Product Category: Electronics
Industry: High Tech


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How much detail do you need when modeling a PCB?

PCBs can be difficult to model for mechanical analysis because they have a large number of components of various materials all contained within small dimensions. To overcome these challenges, PCB models are often simplified for analysis. However, modeling with too few details can lead to insufficient results, while including too many details can lead to computationally expensive models. The type of analysis to be performed and the board design can also call for varying levels of detail.

This webinar will help guide analysts on the level of detail required when setting up PCB models.

Author: ANSYS, Inc. Type: Webinar Date:
Product Category: Structures
Industry: High Tech
Sub Industry: Packaging


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Radically Improving Engineering Productivity in the Aerospace and Defense Industry With ANSYS Fluent 2020 R1

This cutting-edge webinar explores how aerospace and defense industry engineers will significantly improve their productivity with exciting new enhancements featured in ANSYS Fluent’s 2020 R1 release. Through live demonstrations and success stories from early users, you will learn how Fluent substantially reduces hands-on development time and drastically boosts efficiency with a single-window, task-based workflow and a dynamic Mosaic-enabled meshing technology. Additionally, real-world case studies will highlight how Fluent’s upgraded proprietary numerics make tackling even the most challenging hypersonic problems seem easy.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Fluent
Product Category: Fluids


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On-demand webinar - GRANTA MI Pro — A Fast-Start Solution to Managing Materials Data for Design and Simulation

Watch this webinar to learn about GRANTA MI Pro — a new, fast-start solution that enables you to quickly implement a materials information management system for your design and simulation teams. MI:Pro helps engineers find and compare design and simulation data for engineering materials, and to use it with their preferred CAD and CAE tools. 

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS GRANTA MI
Product Category: Materials


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Amélioration les Performances des Matériaux : les Revêtements et leur Sélection en Recherche

Identifier un bon revêtement pour la protection mécanique / chimique / thermique d'un substrat est un défi, compte tenu du grand nombre de solutions techniques possibles. Dans ce séminaire en ligne, nous montrerons comment trouver des données pour les revêtements dans ANSYS Granta Selector 2020 pour la comparaison des performances et la sélection des revêtements.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS CES EduPack
Product Category: Materials


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電磁場現象について ~Maxwell方程式を理解する~

全ての電磁場現象を説明できるMaxwell方程式について、出来る限りわかりやすく説明いたします。

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  • Maxwell方程式の全体像をつかみたい方
  • Author: ANSYS, Inc. Type: Webinar Date:
    Product Name: ANSYS Maxwell


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    Additive Manufacturing 2020 R1 Update

    ANSYS additive solutions continue to evolve at a rapid pace. A variety of new enhancements and features come as part of ANSYS 2020 R1, including the ability to work with EOS printers, using the inherent strain approach in ANSYS Workbench Additive, and new materials in ANSYS Additive Print and Science.

    Watch this webinar to learn about everything new and get a sneak peek at what is upcoming in 2020.

    Author: ANSYS, Inc. Type: Webinar Date:
    Product Name: ANSYS Additive Print, ANSYS Additive Prep, ANSYS Additive Suite


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