Lightweighting through design for additive manufacturing (DfAM) has gained a lot of attention recently. And, while performing topology optimizations or applying lattices for your additive manufactured product is beneficial and in many cases critical, it is also necessary to validate and optimize these designs to ensure accurately printed parts and avoid unnecessary, expensive iterations. ANSYS offers a comprehensive and scalable software solution for additive, which minimizes the risks within your additive manufacturing processes and delivers high-quality, certifiable parts.

In this webinar, we will see how a user ran a part through a series of validations to produce a truly functional lightweight structure on a metal 3D printer.

ANSYS Distributed Compute Services (DCS) is a family of applications that allows you to efficiently and robustly distribute, manage and solve simulations across a heterogeneous variety of compute resources. It includes a Design Point Service (DPS) to help you manage (run, filter, sort and compare) tens of thousands of design points spread across clusters, networks and operating systems. It can even break up a project so that parts of it (such as geometry creation) can be handled on resources best suited for it while other parts (such as the solver runs) can be handled on hardware best suited for those sorts of tasks.  DCS can help you get the most out of your available compute resources, and then DPS can help you sort through the results to find the best designs. 

Simulation run times are up to 4.8 times faster using a current workstation equipped with a powerful GPU compared to an older system.

As the availability of affordable computing power increases and simulation software is optimized to take advantage of those hardware improvements, more design engineering teams are able to realize the incredible benefits of a simulation-led workflow. We put this notion to the test by benchmarking modern ANSYS Mechanical 2019R1 software on a three-year old Dell workstation and comparing it to the same software running on its comparable present-day counterpart. We discovered that updating the computer enabled completion of the same simulations as much as 71% faster.

Download the new “Productivity Study: ANSYS Mechanical” report to see how investing in modern hardware with a faster GPU can improve your workflow.

The next generation of wireless technology — driven by 5G — will transform the way we communicate, commute and collaborate with machines and humans alike in the near future. Ubiquitous connectivity, low latency and faster data rates will enable billions more smart devices. 5G will enable increased data traffic between end-user devices (including IoT) and data centers.

To address the high volume of data that will be generated, data centers will require increased processing speed and memory bandwidth. DDR5 memory will be a key enabler in data centers to support large data access and increased data rates for 5G applications. Meeting DDR5 signal integrity (SI) and power integrity (PI) specs will be challenging. SI and PI need to be simulated together to provide accurate results to avoid under- or over-design.

Jonghyun Cho of Rambus presented SI/PI methodologies using ANSYS solutions to accurately model chip, package and board for system-level simulations. He also discussed the critical need for comprehensive chip-package-system co-analysis to meet the stringent SI/PI requirements of DDR5.