Resource Library

CADにとらわれないワークフローでは、考えたこともないかもしれないデータの準備と管理に関する洞察を得ることができます。Ansys SPEOSとCADソリューション間の独自の接続により最適な製品パフォーマンスを実現します。これにより、形状が変更されるたびにシミュレーションプロジェクトが即座に更新されます。

このwebinarで学べること:

• Ansys SPEOSとのCAD接続をセットアップ
• データの準備
• データ準備を強化するワークフローをマスター
• ワークフローを自動化する基本的なスクリプト作成

Ansys SPEOS Premiumライセンスの導入で使用可能となった機能をまだお使いいただけていないユーザー様へ
Premiumライセンスで使用できる機能の活用法をご紹介します。

代表的な機能

• 迷光解析
• 3Dエネルギー密度受光面
• 3Dテクスチャ
• イメージテクスチャ

「特定の人が使うもの」というイメージが強いCAEですが、製品開発に関わる様々な場面でCAEを利用する海外企業が増えてきています。「圧倒的な計算スピード」と「ユーザーを選ばない使いやすさ」を活かした「インスタントに使えるCAEツール」 ANSYS Discovery を、新たなシーンでの活用事例を交えながらご紹介いたします。

レベル：

初級～中級（開発プロセスをおおまかでも、理解されている方）

こんな人に受講をおすすめ：

• CAEの社内展開活動をご担当れている方
• 開発プロセスの効率化をご検討されている方
• 技術支援をご担当されている方

Ansys Optical Measurement Device (OMD) solutions enhance your color and trim processes and provide your clients with a realistic, detailed view of the final product.

Featuring high usability by providing nonlinear functions, Multiscale.Sim is a fully compatible add-in tool, embedded in the Ansys Workbench environment. Helping you design composite materials such as fiber or filler, reinforced plastic, porous, lattice and honeycomb, Multiscale.Sim enables you to understand macroscopic material behavior and material constants based on virtual testing of microstructure models.

A free version of Multiscale.Sim with limited functionality is available now in the Ansys Store and a full version containing every feature will be released to the Ansys Store soon.

Join us for this free webinar that spotlights Multiscale.Sim’s exciting features, providing high-performance productivity for Workbench users.

• Explore current features in Multiscale.Sim’s free trial version and preview new features in the upcoming full version.
• Discover how to use the multiscale analysis technique to surmount complicated materials problems.
• Understand how to assess every material constant without costly experimental campaigns.
• Learn how to use Multiscale.Sim to overcome materials modeling and characterization challenges.

Companies around the world continuously seek to optimize their products and improve on existing performance. The shape optimization process can often be time-consuming, requiring substantial manual inputs and multiple design iterations.

Adjoint Solver — a free add-on module available with Ansys Fluent — enables shape optimization in a smart and automatic way with minimal turnaround time. Using its unique sensitivity-based algorithm, Adjoint Solver helps optimize your existing design and export the morphed geometry.

Join us for this free webinar which details how Adjoint Solver can help you optimize the shape of your components and radically reduce your simulation time.

• Learn how to find your optimal shape and automatically morph your shape.
• Receive expert tips on managing your Adjoint Solver workflow.
• Understand how you can perform mesh-morphing quickly and automatically using Ajoint Solver’s design tool.
• Discover how to easily export your modified meshes directly to CAD.

The concept of eigenstrain is a link between solid mechanics and other physical phenomena which cause a change of shape or dimension in a material. These include plasticity, creep, vacancy-assisted deformation, twinning, thermal expansion, dimensional changes due to phase transformation and curing, etc. Although these physical phenomena can lead to deformation, it is only the elastic strain that can cause stress.

In this webinar, we will discuss the applications of finite element analysis to study eigenstrain problems of thermal distortion and residual stresses during heat treatment, welding, polymer curing and additive manufacturing. What makes these problems challenging is the fact that many of these problems are multiphysics in nature, with each physics having different spatial and temporal scales. Since solid mechanics is agnostic to the origin of eigenstrain, it is possible to account for the cumulative effort of all the multiphysics causing eigenstrain into any one phenomenon that causes eigenstrain. Recent advances in using machine learning to model the cumulative effects of all the multiphysics, without requiring knowledge of the physics of each phenomenon, will also be discussed.

This webinar will give you a basic understanding of the equations of micromechanics in the presence of eigenstrains and their application.

 

With increasing demands on modern electronics systems, design engineers are faced with the challenge of balancing electrical, thermal and mechanical requirements to optimize the reliability of electronics hardware.

Ansys revolutionizes electronics designs by empowering engineers to accurately model printed circuit board (PCB) assemblies and simulate real-world operating conditions. Utilizing Ansys physics-based simulations, engineers can evaluate and mitigate potential PCB failure risks early in the design phase to ensure product safety, meet warranty targets and reduce physical tests.

Join us for this webinar which showcases how Ansys technologies are used as a comprehensive multiphysics solution to optimize PCB reliability.

• Learn how to balance the electrical, thermal and mechanical requirements to optimize the reliability of electronics hardware.
• Receive expert insights on using Ansys physics-based simulations to accurately model PCB assemblies and simulate real-world operating conditions.
• Understand how to leverage Ansys physics-based simulations to evaluate and mitigate possible PCB failure risks.

Battery thermal management for high-power applications such as electric vehicles (EVs) and hybrid electrical vehicles (HEVs) is crucial to prevent thermal runaway. This application brief describes a reduced-order model (ROM) for battery thermal management, called LTI ROM, based on properties of linear and time-invariant (LTI) systems. The LTI-ROM is shown to provide very similar results to those from computational fluid dynamics (CFD) under any transient power dissipation. The ROM runs orders of magnitude faster than the original CFD model.

Battery thermal management for high-power applications such as electric vehicles (EVs) and hybrid electrical vehicles (HEVs) is crucial to prevent thermal runaway. This application brief describes a reduced-order model (ROM), called SVD-ROM, based on singular value decomposition (SVD). This ROM provides results very similar to those from computational fluid dynamics (CFD) under any transient power dissipation. The ROM runs orders of magnitude faster than the original CFD model.