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When making decisions between different design concepts, you must consider performance, price and the environment. This difficult task often requires input from many experts who must make a hard decision at the end of the project. Making changes later in the design process can be very costly and time-consuming, so any tool that can help early in the design phase has a massive impact on development projects.

In this webinar, we demonstrate how Ansys GRANTA Selector can help make these choices in a more rational way, saving time and money for both material selection and production methods. Flanders Make, a specialist research center, has spent 3 years automating this process from CAD to extend the benefits of part cost estimation from a component to a system level. The process also determines the total cost for different design concepts in a uniform and comparable way.

Ansys Elite Partner Infinite Simulation Systems supported the production of this webinar.

What you will learn:

• How to innovate through material selection and reduce component cost
• How to quickly confirm and validate your material selection using a reliable, impartial data set
• How to automate this process at the CAD stage for full cost estimation of components and system

Ansys Sherlock is the only physics of failure (PoF)-based electronics design software that provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early design stages. Sherlock revolutionizes electronic design by empowering designers to simulate real-world conditions and accurately model PCBs and assemblies to predict failure due to thermal, mechanical, shock and vibration conditions.

Sherlock provides fast and accurate reliability predictions in the earliest design stages tailored to specific materials, components, dies, printed circuit board (PCB)/ball grid array (BGA) stackups and specific use conditions. With libraries containing over 500,000 parts, Sherlock translates ECAD into FEA models in minutes and provides insights before prototyping, eliminating test failures and design flaws. Mechanical and electronics designers and engineers, even non-FEA experts, can now quickly and easily predict the reliable lifetime of entire printed circuit board assemblies (PCBAs) under real-world conditions, before a product is even built.

In this webinar, learn how Sherlock can be used to perform the following analyses:

• Solder fatigue (board level/1D)
• Solder fatigue (system level/3D)
• Natural frequency
• Mechanical shock
• Random vibration
• Harmonic vibration
• Plated through hole (PTH) fatigue

Real-world application simulation requires many physics to be simulated together to account for complex interactions. Ansys multiphysics simulations help you to study the complex interactions between fluid, structural, electromagnetic, thermal and other forces to improve product performance and reliability while reducing development time and costs. Multiphysics simulation can enhance your chances of meeting time, cost and quality targets in your next product development cycle.

In this webinar we discuss:

• Sophisticated multisolver coupling capabilities
• The role of the Ansys system coupling tool in solving multiphysics problems
• Industrial case studies involving multiphysics solutions

CFD plays a critical role in the life of turbomachinery from design optimization of the flow path to generating reduced-order models for real-time predictive maintenance. Ansys is continuing to improve our state-of-the-art workflows for turbomachinery design and analysis so you can maximize your product’s performance and efficiency.

In this webinar, we will review the complete Ansys turbomachinery solution with a special focus on recent advancements, including:

• Performance map automation
• Aero-thermal and aeromechanics workflows
• Icing
• Transient blade row methods including harmonic analysis
• External code couplings and interfaces

Design optimization has become an imperative in order to achieve optimum product performance and save costs, thereby producing smarter designs in less time. This relentless application of optimization technologies and increasing market competition is pushing the limits of existing engineering capabilities. Traditional optimization methods offer single-physics deterministic optimization which many not suffice in case of multiple complex physical and stochastic environments. Therefore, it is important to further engineer product designs using a software tool that offers a framework for multidisciplinary, multi-objective robust design optimization in contrast to single-physics deterministic optimization.

With Ansys optiSLang’s unique capabilities, you can perform product development with high economic efficiency by conducting sensitivity analysis, multidisciplinary optimization, robustness evaluation, reliability analysis and signal calibration using various standard and in-house solvers. optiSLang helps engineers reach an optimal design in stochastic and multiphysics environments to produce a robust, competitive product.

Topics include:

• Sensitivity analysis and reducing unimportant parameters
• Unique response surface generation — metamodel of optimal prognosis
• Optimization methods, robustness and reliability evaluation
• Robust design optimization performance
• Process integration, signal calibration, demo and case studies

While autonomous vehicles (AVs) can improve driver safety and reduce traffic congestion, developing these new vehicle platforms remains rife with challenges. These cars must be physically road tested across billions of miles and accurately respond to millions of diverse scenarios which consumes tremendous development time and cost.

Watch this video — recorded at the Big Compute 20 conference in San Francisco — to learn from Walt Hearn, regional vice president at Ansys and Nidhi Chappell, head of product, Azure HPC-AI at Microsoft on how advanced simulation tools help automotive companies overcome that substantial testing barrier.

Learn how AV designers use Ansys software to cost-effectively and rapidly test countless scenarios virtually, substantially accelerating development and significantly reducing the need for physical road testing. Furthermore, you will understand how model-based development tools help create software that is more robust, less error-prone and safer on the road. Lastly, you will discover how these tools can cut development time in half and shave 40% off the costs of code validation and verification.

Watch this webinar to learn about the new capabilities available in Ansys SIwave and Ansys HFSS 3D Layout in 2020 R1. The latest release includes powerful new features for the design of high-speed electronics devices. New capabilities and enhancements focus on signal integrity, power integrity and electromagnetic interference analysis, including:

• EMI Xplorer – new technology to perform “what if” analyses to improve EMI characteristics in real time
• Chip Model Analyzer for system simulations containing cascaded models of ICs, packages and PCBs
• Stack-up wizard enhancements
• SIwave simulation with parallel HFSS regions
• Via Backdrill UI
• Multizone PCB support within HFSS 3D Layout [beta]
• Native 3D component support in HFSS 3D Layout designs [beta]
• SIwave AC solver Advanced Coupling Detection
• SIwave/Ansys Icepak package on PCB enhancements

Managing heat and controlling temperature are critical to the efficiency, reliability, safety and durability of many products and processes. Simulation enables engineers to not only identify and mitigate thermal problems, but also to evaluate and optimize the design under different operating scenarios. Join us for an overview of Ansys’ heat transfer simulation technology for thermal management of mechanical, fluids and electronics systems. A broad range of applications across several industries will be covered.

The use of electronics is ever increasing in automotive applications. Automotive designers however must still adhere the same size and packaging constraints to ensure vehicle size and weight does not increase. Because of this, there has been a push to make electronic components and packages smaller, while increasing performance. Continental Automotive has seen increased use of Ball Grid Array (BGA) components and High Density Interconnect (HDI) FR4 boards in their Printed Circuit Board Assemblies (PBCA). These changes have not been without their issues and Continental has noticed additional reliability issues in solder joints due to solder fatigue. Therefore the capability to predict these failures is critical, allowing Continental to avoid these failures with design changes.

Currently the ability to predict high cycle fatigue (vibration) solder and copper leads can be accomplished using Miner’s Rule. However the ability to predict low cycle fatigue due to thermal cycle is required. Continental chose to overcome this obstacle by employing Ansys Sherlock to model their board and components. Sherlock’s key advantage for this project was its ability to model and run multiple iterations quickly, minimize thermal cycle and shock validation tests, determine the largest contributor to stress/strain and allow for changes to layout.