À medida que a nossa busca por ultrapassar fronteiras, aprender mais e alcançar outros cantos do nosso universo continua a crescer, também cresce a necessidade de desenvolver a tecnologia inovadora que nos levará até lá.

Participe deste webinar para descobrir como a Edição Aeroespacial do CES EduPack permite executar uma seleção avançada de materiais para que um veículo de exploração de Marte atravesse a atmosfera do planeta, inspirando os alunos com um estudo de caso sobre exploração espacial.

¿Impartes clases en carreras de ingeniería, ciencia o diseño? El aprendizaje activo ofrece al estudiante diferentes vías para interactuar con el contenido del curso, sin duda, una buena forma de conseguir una mayor implicación y aprendizaje. En este seminario online exploraremos diferentes herramientas y recursos para ayudaros a implementar un enfoque de enseñanza más interactivo a través de diferentes niveles y áreas de conocimiento.

Teaching others how to think critically is a difficult task. Some teaching techniques work; others do not—but why is this the case? Hear from Dr. John Nychka, University of Alberta, on different teaching methods and their effectiveness in supporting students as they learn how to think reflectively, and in a critically reflective manner.

Accurate materials information is essential for any product development organization, particularly one that is aiming to make pervasive use of simulation. A single, gold-source of materials information is the best way to ensure accuracy and traceability for simulation teams, product designers across the product development lifecycle. In this webinar, we’ll see how the new GRANTA MI 2020 release meets this need with a significantly improved user experience across the enterprise.

• Get a tour of the improved user experience across the key apps in GRANTA MI 2020.
• Learn how these interfaces can be used by product designers, simulation teams, materials teams and IT Admins to do their jobs faster and with fewer errors.
• See how GRANTA MI can help you to deliver on the promise of pervasive simulation, with materials information you can trust, when and where you need it.

ANSYS Discovery is empowering engineers, and especially designers, to avoid unnecessary prototyping through interactive design exploration. In recent years, manufacturing organizations have been identifying methods to democratize prototyping, specifically using additive technology, to minimize costs and choose the best designs. In this webinar, we’ll introduce you to ANSYS Discovery for upfront design exploration, and demonstrate how its additive prep features can be used across multiple industries.

What you will learn:

• How designer-level tools can provide engineers with upfront guidance to make better design decisions
• Why rapid design exploration is a fundamental step in the manufacturing process
• How to manipulate imported geometry, whether provided by suppliers or internal teams
• How to eliminate your prototyping problems upfront, and iterate quickly through simulation-led design

Simulation run times are up to 4.8 times faster using a current workstation equipped with a powerful GPU compared to an older system.

As the availability of affordable computing power increases and simulation software is optimized to take advantage of those hardware improvements, more design engineering teams are able to realize the incredible benefits of a simulation-led workflow. We put this notion to the test by benchmarking modern ANSYS Mechanical 2019R1 software on a three-year old Dell workstation and comparing it to the same software running on its comparable present-day counterpart. We discovered that updating the computer enabled completion of the same simulations as much as 71% faster.

Download the new “Productivity Study: ANSYS Mechanical” report to see how investing in modern hardware with a faster GPU can improve your workflow.

Lightweighting through design for additive manufacturing (DfAM) has gained a lot of attention recently. And, while performing topology optimizations or applying lattices for your additive manufactured product is beneficial and in many cases critical, it is also necessary to validate and optimize these designs to ensure accurately printed parts and avoid unnecessary, expensive iterations. ANSYS offers a comprehensive and scalable software solution for additive, which minimizes the risks within your additive manufacturing processes and delivers high-quality, certifiable parts.

In this webinar, we will see how a user ran a part through a series of validations to produce a truly functional lightweight structure on a metal 3D printer.

ANSYS Distributed Compute Services (DCS) is a family of applications that allows you to efficiently and robustly distribute, manage and solve simulations across a heterogeneous variety of compute resources. It includes a Design Point Service (DPS) to help you manage (run, filter, sort and compare) tens of thousands of design points spread across clusters, networks and operating systems. It can even break up a project so that parts of it (such as geometry creation) can be handled on resources best suited for it while other parts (such as the solver runs) can be handled on hardware best suited for those sorts of tasks.  DCS can help you get the most out of your available compute resources, and then DPS can help you sort through the results to find the best designs. 

The next generation of wireless technology — driven by 5G — will transform the way we communicate, commute and collaborate with machines and humans alike in the near future. Ubiquitous connectivity, low latency and faster data rates will enable billions more smart devices. 5G will enable increased data traffic between end-user devices (including IoT) and data centers.

To address the high volume of data that will be generated, data centers will require increased processing speed and memory bandwidth. DDR5 memory will be a key enabler in data centers to support large data access and increased data rates for 5G applications. Meeting DDR5 signal integrity (SI) and power integrity (PI) specs will be challenging. SI and PI need to be simulated together to provide accurate results to avoid under- or over-design.

Jonghyun Cho of Rambus presented SI/PI methodologies using ANSYS solutions to accurately model chip, package and board for system-level simulations. He also discussed the critical need for comprehensive chip-package-system co-analysis to meet the stringent SI/PI requirements of DDR5.