HFSS layout-driven assembly

Ansys HFSS 3D Layout Workshop

August 19, 2020

10:00 AM - 12:00 PM (PDT)

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Venue:
Online

Contact:
Verly Flores

Join Ansys for a virtual workshop to see our latest advanced technology to solve your most challenging (PCB's), packages, and integrated circuit designs. Ansys HFSS and its specialized 3D layout interface allows users to easily create layered geometries or import 3D layouts from 3rd party software and streamlines the process of setting up the model and creating ports. Ansys HFSS 3D Layout uses an innovative meshing technology, Phi mesher, for simulating layered structures such as planar antenna, ICs, PCBs of high-frequency electromagnetic fields. However, under many circumstances, an arbitrary 3D objects such as various types of connectors will be involved in the simulation. How can HFSS 3D layout handle this type of problem?

In this demonstration, we will show how to combine a 3D connecter from HFSS MCAD (fully arbitrary 3D), with a printed circuit board (PCB) in HFSS 3D Layout, all running in Ansys Electronics Desktop (AEDT). This arbitrary 3D connector will also be integrated into the HFSS 3D layout design, demonstrating how to run a hierarchical design. Differential S-parameters will be computed from the simulation run. Current simulation technology enables heightened attention to details that may have been previously overlooked in the design process. One such detail is the design of connections in structural assemblies, and the performance of bolted connections throughout the product life cycle. With the challenges faced by designers and analysts today, it is increasingly important to stay at the forefront of technology to continue to meet consumer needs.

Space is limited. Register now to reserve your spot.

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