ANSYS SCADE Vision is a powerful software tool that can address inherent weaknesses in AI-supported perception systems for autonomous vehicles by pinpointing hundreds of potential edge cases quickly and affordably. Edge cases are objects in a traffic scenario that have less recognizable shapes than standard traffic signs and automobiles, such as a baby stroller or a person in a wheelchair. Obviously, misclassifying such objects poses a significant safety risk.

SCADE Vision minimizes the cost of edge case resolution and perception system validation by automatically detecting the weaknesses in these systems. As it reviews video-based sensor data while exercising AI-based perception system algorithms, SCADE Vision augments key areas for closer analysis. Based on that augmentation, which is intended to reproduce the wide variety of conditions that a deployed system will encounter, SCADE Vision automatically identifies and flags any abnormalities, with no human intervention.

Early adopters of this innovative technology have reported a 30X acceleration in detecting edge cases compared to manual methods. Perception engineering teams can achieve a significant time, cost and safety advantage by capitalizing on this advanced technology from ANSYS.

XTPL is developing and implementing tailor-made solutions in terms of nanoprinting and ultraprecise deposition for several sectors, mainly in the field of printed electronics. Using ANSYS Mechanical and ANSYS Fluent simulation solutions, they developed a model that helped them optimize the printing and material parameters, as well as the geometry of the printing nozzle, saving them time and money while improving their ultraprecise printing process.

Achieving power efficiency, power integrity, signal integrity, thermal integrity and reliability is paramount for enabling product success by overcoming the challenges of size and complexity in AI hardware and optimizing the same for rapidly evolving AI software. ANSYS’ comprehensive chip, package and system solutions empower AI hardware designers by breaking down design margins and siloed design methodologies with multiphysics simulations and multi variable analytics to exceed PPA and reliability goals. ANSYS brings together the power of big data analytics, elastic compute scalability and multiphysics simulations to simultaneously address power, thermal, variability, timing, electromagnetics and reliability challenges across the spectrum of chip, package and system to promote first time silicon to system success.