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3D-IC Foundry Frameworks

Join us on June 28th; Ansys R&D members will discuss an overview of the 3D-IC technology development frameworks offered by TSMC, Samsung, and Intel and how Ansys simulation tools and workflows fit into those frameworks.

June 28, 2023


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About this Webinar

Semiconductor applications such as Mobile (5G), Automotive, and Datacenter (HPC, AI) demand better scaling, performance, and lower power usage. Advanced packaging is moving towards 3DIC systems to address these needs, as evidenced by the technology directions from TSMC, Samsung, and Intel. We'll present a comprehensive overview of these technologies, and the Ansys flows to address EMIR, Thermal integrity, and mechanical stress challenges posed by these 3DIC systems.

What You Will Learn

  • Advanced 3DIC packaging trends and challenges faced by engineers
  • 3DIC system data flows from P&R to analysis tools
  • EMIR and Thermal Integrity flows using RedHawk SCTM and RedHawk SC ElectroThermalTM


3D-IC Foundry Frameworks

Mallik Vusirikala is a Director Product Specialist at Ansys, responsible for strategic directions and deployment of the RedHawk product line for Power integrity. He’s been with Ansys for over 12 years, and before that, he was with Texas Instruments in CAD flow/ methodology group developing multiple flows for standard cell library creation. He obtained a bachelor’s degree with Honors in Computer Science and Engineering from the National Institute of Technology, Hamirpur (India).


Prakash Vennam is RD Director at Ansys, responsible for 3DIC modeling and electrothermal product lines. He has worked with Ansys for over 15 years in 3D full-wave electromagnetic products and parasitic extractions. Before joining Ansys, he was a developer and RD manager at Sigrity, Inc., responsible for 2.5D EM products for package and PCB analysis. He has a Ph.D. in microwave engineering from the Indian Institute of Science, Kharagpur, India, and has over 200 publications covering computational electromagnetics, 3DIC modeling, and electrothermal areas.

3D-IC Foundry Frameworks
3D-IC Foundry Frameworks