Software Solutions for PCB Design and Simulation
Ansys offers a complete, most powerful, accurate and scalable simulation solution for printed circuit boards (PCBs), integrated circuits (ICs), and IC Packages for accurate evaluation of an entire system.
ANSYS APPLICATIONS
PCB Board Modeling and Simulation
Printed circuit boards (PCBs), ICs and IC packages are used in almost all electronic products across all industries: automotive, A&D, consumer electronics, healthcare and energy. With electronics getting smaller, engineers need to design boards that are smaller than ever and incorporate all the required features. Accurate modeling and simulation of these components are key to reliable end products.
-
SI, PI and EMI Analysis
-
Electrothermal Analysis
-
Shock and Vibration Analysis
-
Reliability Prediction
Signal and Power Integrity
Ansys signal integrity (SI) analysis products are essential for designing the high-speed serial channels, parallel buses and complete power delivery systems found in modern high-speed electronic devices. These integrated electromagnetics (EM) and circuit simulation tools predict EMI/EMC, power integrity and SI issues, resulting in optimized system performance prior to the build-and-test process.
Thermal Mechanical Stresses
The potential for failure in electronic systems due to thermal and mechanical loading of printed circuit boards (PCBs) is escalating due to steadily increasing power dissipation, combined with smaller board sizes. Learn how to prevent PCB failures due to thermal and mechanical stresses.
Electromagnetic Interference
It is not uncommon to have a design fail in the field due to signal integrity issues, even though simulation shows it should work perfectly, because the as-manufactured product differs from the design definition. To avoid this problem, the signal integrity engineer needs to understand what will be delivered and use simulation to verify that the frequency- and time-domain performance will meet the design requirements.
Electronics Reliability
Ensuring electronics reliability is a multi-pronged effort, involving selection, optimization and design rules. But, at the end of the day, almost every organization needs a reliability prediction. How long before the product fails and how will it fail?
Featured Products
고주파, 고속의 전자부품을 설계하는 3D 전자기장 솔버. FEM, IE, 점근 및 하이브리드 솔버는 RF, 마이크로파, IC, PCB및 EMI 문제를 해결합니다.
- 멀티 레이어 패키지 솔빙
- PCB 및 패키지에 대한 3D 레이아웃 워크플로우
- 고주파 전자기기 솔버
- 3D 컴포넌트를 통한 IP 보호
A specialized tool for simulating power and signal integrity as well as EMI analysis of IC/PCB packages. Solve for power delivery systems and high-speed channels in electronic devices.
- Electrothermal and mechanical analysis
- IBIS and IBIS-AMI SerDes analysis
- Virtual compliance
- Impedance, crosstalk and EMI scanning
- Automated decoupling capacitor Optimization
A computational fluid dynamics (CFD) solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies, enclosures and power electronics.
- Unstructured, body-fitted meshing
- Built-in high-fidelity CFD solver
- Comprehensive thermal reliability solution
- Industry leading multiscale multiphysics
- Board-level electrothermal coupling
- Extensive libraries for thermal physics
Ansys Q3D Extractor는 전자 제품에 대한 주파수 종속 저항, 인덕턴스, 캐패시턴스 및 컨덕턴스(RLCG)의 기생 매개 변수를 계산합니다.
- 솔리드 모델링
- 전원/신호 무결성 분석
- 다양한 추출 유형
- 자동, 적응형 메시 정제
초기 설계 단계에서 구성 요소, 보드 및 시스템 레베의 전자 하드웨어에 대한 신속하고 정확한 수명 예측으로 향후 설계를 대비할 수 있습니다.
- 솔더 피로 해석
- ECAD를 FEA/CFD로 빠르게 변환
- 응력(열, 구조)을 통해 수명 예측
- 수정 가능한 임베디드 라이브러리
- 검증된 파손 시간 예측
- Electromagnetic on-silicon modeling
- Includes gold standard HFSS engine
- High-capacity and linear multi-CPU scalability
- S-param and RCLk parasitic extraction
- Models power grids, clock trees, spirals, MiM/MoM caps, etc.
- Foundry certified and silicon correlated
- RLCk signoff extraction tool (post-LVS)
- Models electrical, magnetic and substrate coupling
- Highly reduced lumped-element models
- Complements digital RC extractors
- Extract entire SoC power grid in minutes
- What-if capability with point-and-click GUI
- Golden IR-drop signoff verification for digital designs
- Electromigration reliability signoff
- Timing impact of dynamic voltage drop aggressors
- High-capacity cloud-native infrastructure
- Advanced power analytics and build quality metric
- Foundry certified for all finFET to 3nm
- Power integrity and noise verification at transistor level
- Totem-SC offers an ultra high-capacity version of Totem
- Capacity for several million xtor flat
- Simultaneous simulation of digital and analog blocks
- Abundant what-if scenarios
- Incremental analysis
- Creates IP power models for use with RedHawk-SC
- RTL design-for-power platform
- Analysis-driven power reduction
- Physically-aware RTL power budgeting
- Long vector profiling
- Direct links to hardware emulators
Continental Automotive chose Ansys Sherlock for its ability to quantify the changes in reliability of a component due to various system-level effects, including the thermomechanical influence of adhesives.
Featured Resources
WEBINARS
On Demand Webinar
Practical Ports for Perfect Performance
This webinar spotlights the theoretical basis of various port types and how to use them in real designs to deliver maximum accuracy.
On Demand Webinar
Ansys 2020 R2: Advancements in Ansys Slwave
This webinar delivers a deep dive into Ansys SIwave’s many significant advancements offered in Ansys 2020 R2.
On Demand Webinar
Electrical and Thermal Reliability Analysis of PCB with Ansys SIwave, Icepak, Mechanical and Sherlock
In this webinar, learn how Ansys SIwave, Ansys Icepak, Ansys Mechanical and Ansys Sherlock can be used as a comprehensive multi-physics solution to optimize PCB reliability.
CASE STUDIES
Ansys가 귀사를 위해 무엇을 할 수 있는지 알아보십시오.
Ansys가 귀사를 위해 무엇을 할 수 있는지 알아보십시오.
Contact Us
문의하기
