A specialized tool for power integrity, signal integrity and EMI analysis of IC packages and PCBs. Solves power delivery systems and high-speed channels in electronic devices.
SIwave helps you model, simulate and validate high-speed channels and complete power delivery systems typical in modern high-performance electronics. It accurately extracts multi-gigabit SERDES and memory buses, providing product sign-off compliance for various designs. SIwave’s full wave extraction of complete power distribution networks (PDN) enables you to verify noise margins and ensure impedance profiles are met through automatic decoupling analysis in low-voltage designs.
SIwave helps you model, simulate and validate high-speed channels and complete power delivery systems typical in modern high-performance electronics. It accurately extracts multi-gigabit SERDES and memory buses, providing product sign-off compliance for various designs.
New wizard in SIwave provides an automated workflow to improve setup time required for PCB designs with DDR.
A unique technology that bolsters the accuracy of simulating signal nets with 3D discontinuities such as bondwires, vias and solderballs. This capability allows users to designate critical parts of a layout for full-wave 3D analysis using HFSS, leading to improved performance and reliability of high speed digital systems.
SIwave includes a bidirectional coupling to Icepak, the leading electronics thermal management solution, creating comprehensive thermal integrity design flow. This improves accuracy by incorporating detailed ohmic losses from SIwave in the Icepak thermal analysis, which in turn provides temperature information for an accurate DC IR simulation back in SIwave.
Capabilities
Successful design of next-generation electronic products requires power integrity, signal integrity and thermal integrity co-analysis. SIwave uniquely handles the complexity of interconnect design from die-to-die across ICs, packages, connectors and boards.
SIwave enables electronics companies to achieve a competitive advantage with faster time to market, reduced costs and improved system performance.
SIwave helps you understand the performance of high-speed electronic products long before building a prototype in hardware.
There are various extraction types supported by SIwave such as IC packaging RLCG IBIS for signals and power, touch panel RLCG unit cell, bus bar RLCG, power inverter/converter, and a specialized thin-plane solver for touch panel extractions.
EMI Scanner and EMI Xplorer provide automatic and customizable EMI design rule checks to quickly identify areas of potential interference on the design prior to simulation.
The programming environment enables customization of compliance reporting for several standards, including: DDR, USB, PCIe, MIPI, CISPR, etc. Additionally, our new SPISim technology allows for simple compliance reporting for USB-C and COM calculations for IEEE 802.3bj and 802.3bs channels.
This multiphysics solution enables accurate thermal modeling of IC packages and PCBs using DC power loss from SIwave as a heat source. Icepak solves the challenges associated with dissipation of thermal energy from electronic components that may cause premature component failure due to overheating. You can then evaluate thermal stress with Ansys Mechanical. This multiphysics approach enables you to perform coupled EM–thermal–stress analysis for a complete understanding of the design prior to manufacturing.
