A specialized tool for power integrity, signal integrity and EMI analysis of IC packages and PCBs. Solves power delivery systems and high-speed channels in electronic devices.
SIwave helps you model, simulate and validate high-speed channels and complete power delivery systems typical in modern high-performance electronics. It accurately extracts multi-gigabit SERDES and memory buses, providing product sign-off compliance for various designs. SIwave’s full wave extraction of complete power distribution networks (PDN) enables you to verify noise margins and ensure impedance profiles are met through automatic decoupling analysis in low-voltage designs.
SIwave helps you model, simulate and validate high-speed channels and complete power delivery systems typical in modern high-performance electronics. It accurately extracts multi-gigabit SERDES and memory buses, providing product sign-off compliance for various designs.
July 2021
In Ansys 2021 R2, Ansys SIwave contains new features that benefit PCB designers, SI/PI analysts and electrothermal engineers. The major changes include support for temperature-dependent materials in AC solver, the introduction of a new thermal link and SI Xplorer utility.
Support for temperature-dependent materials in the AC solver allows you to modify the conductivity of plane and traces, and derate the response of dynamic capacitors. This helps you to evaluate the performance of PCBs and packages at different temperatures more reliably.
An updated thermal link provides a more robust electrothermal design using Ansys Icepak from the Ansys Electronics Desktop.
The new SI Xplorer utility helps PCB designers to define stack-up and optimize via transitions in a single interface. SI Xplorer combines the already available built-in layer Stackup Wizard capability with the Via Wizard functionality in a single tool kit.
SIWAVE CAPABILITIES
Successful design of next-generation electronic products requires power integrity, signal integrity and thermal integrity co-analysis. SIwave uniquely handles the complexity of interconnect design from die-to-die across ICs, packages, connectors and boards.
SIwave enables electronics companies to achieve a competitive advantage with faster time to market, reduced costs and improved system performance.
SIwave helps you understand the performance of high-speed electronic products long before building a prototype in hardware.
There are various extraction types supported by SIwave such as IC packaging RLCG IBIS for signals and power, touch panel RLCG unit cell, bus bar RLCG, power inverter/converter, and a specialized thin-plane solver for touch panel extractions.
EMI Scanner and EMI Xplorer provide automatic and customizable EMI design rule checks to quickly identify areas of potential interference on the design prior to simulation.
Ansys SIwave provides a DDR virtual compliance kit which in combination with DDR Wizard provides an end-to-end virtual compliance for designs using DDR technology. Additionally, our new SPISim technology allows for simple compliance reporting for USB-C and COM calculations for IEEE 802.3bj and 802.3bs channels. The programming environment also enables customization and support to add eye masks and limit lines for different type of standards.
This multiphysics solution enables accurate thermal modeling of IC packages and PCBs using DC power loss from SIwave as a heat source. Icepak solves the challenges associated with dissipation of thermal energy from electronic components that may cause premature component failure due to overheating. You can then evaluate thermal stress with Ansys Mechanical. This multiphysics approach enables you to perform coupled EM–thermal–stress analysis for a complete understanding of the design prior to manufacturing.
SIWARE CABLE RESOURCES & EVENTS
Learn how the speed and accuracy of Ansys SIwave can be improved by leveraging HFSS Regions in SIwave, a cutting-edge technique for supporting high-speed printed circuit board (PCB) channel design requirements.
