A specialized tool for power integrity, signal integrity and EMI analysis of IC packages and PCBs. Solves power delivery systems and high-speed channels in electronic devices.
SIwave helps you model, simulate and validate high-speed channels and complete power delivery systems typical in modern high-performance electronics. It accurately extracts multi-gigabit SERDES and memory buses, providing product sign-off compliance for various designs. SIwave’s full wave extraction of complete power distribution networks (PDN) enables you to verify noise margins and ensure impedance profiles are met through automatic decoupling analysis in low-voltage designs.
SIwave helps you model, simulate and validate high-speed channels and complete power delivery systems typical in modern high-performance electronics. It accurately extracts multi-gigabit SERDES and memory buses, providing product sign-off compliance for various designs.
January 2022
With 2022 R1, Ansys Electronics solutions continue to bring best-in-class technologies to address PCB, 3D IC package, EMI/EMC, thermal, cabling, and electromechanical design challenges with significant advancements in 5G, autonomous and electrification simulation.
SIwave is first in the industry to run AC simulations such as SYZ extraction along with impedance and crosstalk scanners. This allows engineers to understand temperature effects on the Signal Integrity of their designs.
When a user is leveraging SIwave solver in HFSS 3D Layout, regions are automatically created in areas of 3D activities (such as port locations and vias) and can be modified by the user as desired. This automation speeds up the process of creating HFSS regions by orders of magnitude.
The new SI Xplorer utility helps PCB designers to define stack-up and optimize via transitions in a single interface. SI Xplorer combines the already available built-in layer Stackup Wizard capability with the Via Wizard functionality in a single tool kit.
SIWAVE CAPABILITIES
Successful design of next-generation electronic products requires power integrity, signal integrity and thermal integrity co-analysis. SIwave uniquely handles the complexity of interconnect design from die-to-die across ICs, packages, connectors and boards.
SIwave enables electronics companies to achieve a competitive advantage with faster time to market, reduced costs and improved system performance.
SIwave helps you understand the performance of high-speed electronic products long before building a prototype in hardware.
There are various extraction types supported by SIwave such as IC packaging RLCG IBIS for signals and power, touch panel RLCG unit cell, bus bar RLCG, power inverter/converter, and a specialized thin-plane solver for touch panel extractions.
EMI Scanner and EMI Xplorer provide automatic and customizable EMI design rule checks to quickly identify areas of potential interference on the design prior to simulation.
Ansys SIwave provides a DDR virtual compliance kit which in combination with DDR Wizard provides an end-to-end virtual compliance for designs using DDR technology. Additionally, our new SPISim technology allows for simple compliance reporting for USB-C and COM calculations for IEEE 802.3bj and 802.3bs channels. The programming environment also enables customization and support to add eye masks and limit lines for different type of standards.
This multiphysics solution enables accurate thermal modeling of IC packages and PCBs using DC power loss from SIwave as a heat source. Icepak solves the challenges associated with dissipation of thermal energy from electronic components that may cause premature component failure due to overheating. You can then evaluate thermal stress with Ansys Mechanical. This multiphysics approach enables you to perform coupled EM–thermal–stress analysis for a complete understanding of the design prior to manufacturing.
SIWARE CABLE RESOURCES & EVENTS
Learn how Speos predicts the illumination and optical performance of systems, for both interior and exterior lighting, to help engineers reduce development time and costs while improving their product’s accuracy.
This webinar will cover automotive exterior lighting industry best practices, where an overview of the key benefits of Ansys Speos and Ansys VRXPERIENCE simulations and the capabilities required to realize these benefits will be shared.
Learn how the speed and accuracy of Ansys SIwave can be improved by leveraging HFSS Regions in SIwave, a cutting-edge technique for supporting high-speed printed circuit board (PCB) channel design requirements.
Join us for this webinar which showcases new Ansys EMA3D Cable features to help you streamline manual cable design.
It's vital to Ansys that all users, including those with disabilities, can access our products. As such, we endeavor to follow accessibility requirements based on the US Access Board (Section 508), Web Content Accessibility Guidelines (WCAG), and the current format of the Voluntary Product Accessibility Template (VPAT).
