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Technical Paper

Design and Process Guidelines for QFNS: Manufacturability and Compatibility

By Joelle Arnold, Dr. Craig Hillman, Dr. Nathan Blattau and Jim McLeish

One of the fastest-growing package types in the electronics industry today is the quad-flat no-lead (QFN) package.  This package is also known as quad-flat non-leaded (QFN), lead frame chip scale package (LFCSP), MicroLeadFrame (MLF), MLP, LPCC, QLP, and HVQFN. It consists of an overmolded lead frame with bond pads exposed on the bottom and arranged along the periphery of the package.


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