Join us for the latest 3D-IC webinar series, “Power Integrity Challenges and Solutions for Interposer Design.” The discussion will focus on interposer power analysis as an isolated case and in context with the dice instantiated in a 3D-IC device. The presentation will then explore the completed multi-chip design in a system simulation.
Venue:
Virtual
The trend in chiplet packaging designs is increased density connections to the dies through micro-bumps or even more dense hybrid bonding. This has introduced larger current densities and variations into the power supply network than seen with a single die packaging.
It's common to use an interposer as the interface between the package and the chiplets. The interposer must be able to supply power to each of the chiplets so that the system of dies functions correctly. This webinar will analyze interposers' power integrity in the context of the system of dies they support.
Semiconductor and electronics engineers involved in 3D-IC design
Chris Ortiz is a senior principal application engineer at Ansys. His interests include chip-level modeling for system-level power, signal, and thermal integrity. He has been in the semiconductor industry for over 20 years and received his Ph.D. in physics from the University of Notre Dame.
