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Ansys 2023 R2: Ansys Thermal Integrity What’s New

See the improvements to Ansys Icepak and Ansys Mechanical Thermal as part of the 2023 R2 update to Thermal Integrity for Electronics. Solver and meshing improvements are combined with integrations to other Ansys simulators to enhance designer modeling and simulation of electronics products from a multiphysics standpoint.


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About this Webinar

The 2023 R2 update for Ansys Thermal Integrity solutions in Electronics includes meshing and solver enhancements for both Ansys Icepak and Ansys Mechanical Thermal. The improvements affect performance as well as interfaces with other Ansys simulation tools.

What You Will Learn


  • Joule Heating enhanced meshing & convergence – accessed in AEDT as Boundary-Based Mesh Refinement
  • Significant improvements to Solver Performance – up to 5.3x compared to Classic Icepak and up to 11.4x compared to AEDT Icepak in 2023 R1 release

Mechanical Thermal

  • Thermal Transient Solver – links to Q3D, Maxwell, and HFSS for transient electrothermal simulations, including boundaries and excitations
  • ECAD Modeling – EDB file import and trace mapping, 3D layer support, standard file format with Maxwell, HFSS

Who Should Attend

All electronics designers concerned with thermal issues from the standpoint of computational multiphysics


Jeffrey Tharp is a 15-year veteran of Ansys. With a range of experience from ACE to Product Management, Jeffrey is currently Senior Product Manager for Ansys Thermal Solutions.