Skip to Main Content

Characterization of CEM-1 Boards

One of the more common substrates used in low-cost electronic packaging is composite epoxy material (CEM) laminate. This paper presents some of the key thermohygro-mechanical properties of CEM laminates used in printed circuit board (PCB) fabrication. CEM laminates are defined by material composition with some minimum performance specifications. NEMA1 grade CEM-1 laminates are composed of a cellulose paper core, sandwiched between two layers/ plies of continuous woven glass fabric, infiltrated with a flame-resistant epoxy resin binder NEMA grade CEM-3 laminates are similar, but with a chopped glass fiber core.

The thermal, mechanical, chemical, and electrical properties of CEM substrates can vary depending upon the type of epoxy resin used by the manufacturer, and the fiber selected for reinforcement of the surface layers. This range in material properties can necessitate characterization of the CEM substrate received from the vendor before eventual use. 

SHARE THIS WHITE PAPER

查看 Ansys 的服務與產品

立即聯絡我們

* = 必填欄位

感謝您聯絡我們!

我們將在此解答您的問題,並期待與您交流互動。Ansys 的銷售團隊成員會立即與您聯絡。

Footer Image