Multiphysics Reliability Signoff for Next-Generation Automotive Electronics Systems

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Automotive electronics systems depend on an ever-increasing number of electronic sensors and processing elements, which allow for 360-degree surveillance and object identification/classification. Designing and verifying these systems is, however, as complex as the systems themselves.

This white paper examines how automotive chip designers can achieve the stringent safety and reliability requirements for advanced FinFET designs. It explores analysis solutions for electromigration reliability (EM), electrostatic discharge (ESD), thermal reliability, statistical electromigration budgeting (SEB) and functional safety.

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