A whitepaper on RTL power analysis, estimation and optimization using ANSYS PowerArtist.
Back To Resource Library
Automotive electronics systems depend on an ever-increasing number of electronic sensors and processing elements, which allow for 360-degree surveillance and object identification/classification. Designing and verifying these systems is, however, as complex as the systems themselves.
This white paper examines how automotive chip designers can achieve the stringent safety and reliability requirements for advanced FinFET designs. It explores analysis solutions for electromigration reliability (EM), electrostatic discharge (ESD), thermal reliability, statistical electromigration budgeting (SEB) and functional safety.
Operating power has become one of the most important metrics for modern electronic devices. Qualcomm Technologies, a world-class mobile solution provider, significantly reduced power consumption in an already challenging market by performing power analysis at RTL using ANSYS PowerArtist. Qualcomm Technologies was able to reduce dynamic power by 10 percent through this approach.
Simulation throughout the product development lifecycle has undeniably grown in recent years. The primary drivers behind the increased significance are the improvements in time-to-market, product quality and overall cost. However, the ability to predict product performance faster and more reliably has also allowed designers to release more innovative offerings, open up more market opportunities, and ultimately fuel top-line growth for the business.
HPC may once have been the sole province for huge corporations and national labs, but with hardware and cloud resources becoming more affordable even small- and mid-sized companies are taking advantage. Still, myths and misconceptions stall progress and slow adoption.
Topics covered by this 7-page custom whitepaper include:
Calculating TCO for HPC on-premises versus in the cloud
Finding the best HPC solution to fit your SMB's needs
Licensing, workforce and use-case misconceptions surrounding HPC in the cloud
The Internet of Things (IoT) represents an eleven trillion dollar opportunity. The opportunity will only be fully realized if engineers use best practices to design robust and reliable products. In this e-book we explain the critical design challenges for designing smarter connected products and how ANSYS solutions can help.
This eBook by Aberdeen Group illustrates that Best-in-Class companies approach development in a holistic manner, ultimately leading to a product that meets its intentions, quality, and revenue targets.