During this webinar, we will summarize the options for transferring data from HFSS to circuit tools.
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Radio frequency identification (RFID) tags provide a superior level of inventory management, asset tracking and supply chain management over barcode technology, which requires barcodes to be within sight of the reader. RFID technology can be more broadly applied and becomes increasingly accurate by boosting the range at which tags can be read. Engineers at Honeywell leveraged ANSYS HFSS electromagnetic field simulation software to improve upon current RFID systems. Using HFSS, they were able to virtually evaluate new concepts in less time, significantly reducing product development lead time.
The dramatic rise of smart, connected products requires a rapidly increasing communications bandwidth, but the radio frequency spectrum available is growing at a much slower pace than what is needed. One way the fifth generation of cellular wireless technology, 5G, can address this problem is by leveraging beamforming antennas to send different signals to different areas of the cellular network, enabling multiple simultaneous transmissions at the same time on the same frequency. Pivotal Commware is designing the next generation of these beamforming antennas or cellular base stations and other applications, at a fraction of the cost of existing methods. The company’s engineers use ANSYS HFSS to create antenna designs that meet design requirements on the first or second pass, substantially reducing the time required to bring new antennas to market in this highly competitive industry.
Keeping a smartphone from overheating is becoming more challenging as increasing numbers of transistors and devices are made to fit into a small, sleek design. Qualcomm engineers have developed a way to use simulation to create a smaller model of the power sources in a smartphone. This model can be solved in a fraction of the time of a full thermal analysis, so that they can look at more operating scenarios. The goal is to create a dynamic power management strategy to selectively direct power where it is needed and keep temperatures down.
As organizations strive to deliver innovative smart products for the digital economy they must solve a huge number of design challenges and determine appropriate trade-offs. The only practical way to do this is through engineering simulation.
Smart functionality and connectivity are no longer an option for product development teams — they have quickly become a competitive imperative. How can engineering teams quickly master the complexities of power efficiency, signal integrity and other design challenges as they deliver ongoing innovations? The answer is simulation.
In 2017, Synopsys® and ANSYS partnered to take the best of ANSYS’ power integrity and reliability offerings and create an integrated flow with Synopsys implementation to drive robust semiconductor design optimization. Following the release of RedHawk Analysis Fusion by Synopsys in 2018, customers have shared positive feedback on productivity and design quality impact that have helped drive further innovations on this platform. We sat down with John Lee, vice president and general manager of the semiconductors division at ANSYS, and Jacob Avidan, senior vice president of signoff products at Synopsys, to get their views on the results of this collaboration and how the ANSYS–Synopsys collaboration helps address the challenges of emerging technologies.