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ANSYS Cloud for HFSS

Watch this brief demonstration of accessing high-performance computing (HPC) directly from ANSYS HFSS using a managed cloud service provided by ANSYS and developed in collaboration with Microsoft Azure.

저자: ANSYS, Inc. 형식: Demo Date:
상품명: ANSYS Cloud, ANSYS HFSS


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リアルタイム物理ベース Radar、LiDAR、カメラセンサ シミュレーションを活用した、自動運転/ADAS/EV バーチャル開発環境の構築

様々な制約条件から実機実験が難しい先進車両の開発において、ソフトウェアシミュレーションを活用する事により、実験前に様々な机上検証が行え開発効率の向上が狙えます。この資料を通じて、Radar、LiDAR、カメラセンサーモデルを活用した物理ベースリアルタイムシミュレーションの事例をご覧いただけます。お申込み後、資料のダウンロードリンクURL を別途メールにてご案内いたします。

【資料の詳細】 PDF 23ページ(7.04 MB)

저자: ANSYS, Inc. 형식: Presentation Date:
상품명: ANSYS VRXPERIENCE, ANSYS SCADE Suite
산업: Automotive


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ANSYS® 5G モバイル/UE ソリューション

5G 対応スマートフォンやその他のアンテナ対応 5G ユーザー向け機器 (UE : User Equipment) でシステム全体が想定どおりに動作するには、搭載される小型無線アセンブリの熱的安定性が重要です。消費電力が大きいアプリケーションを多様な環境条件下で利用すると、デバイスの温度が変動し、熱サイクル効果が現れることがあります。

저자: ANSYS, Inc. 형식: White Paper Date:
상품명: ANSYS HFSS, ANSYS Icepak, ANSYS RF Option, EMIT
제품 카테고리: Electronics
하위 산업: Electrical and Electronics


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Manufacturing Speed and Agility Enabled by Turnkey HPC Solutions

Manufacturers face growing competition as new players enter the global market all the time. To stay ahead of rivals, they increasingly rely on digital modeling and simulation tools for product design, analysis and testing with the help of HPC and CAE. So how is HPC enabling innovation for manufacturers from small to large?

This white paper covers:

  • Using HPC to accelerate product development and innovation
  • Making sure HPC is the right fit for your enterprise
  • How Turnkey HPC and Cloud solutions can benefit your business
  • And much more

저자: ANSYS, Inc. 형식: White Paper Date:
상품명: ANSYS Cloud, ANSYS Cloud Hosting Partners
제품 카테고리: High Performance Computing


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ANSYS Fault-Tolerant Meshing for the Oil and Gas Industry

Many important and complex simulations involve dirty and non-watertight geometries; creating a good quality mesh is always a challenging part of any such simulation. These complex meshes consume significant engineering time and effort in geometry preparation, largely involving extensive clean-up and repair. Now, ANSYS Fluent includes a fault-tolerant meshing workflow that can simplify and speed meshing for even the dirtiest geometries with no geometry preparation required.

저자: ANSYS, Inc. 형식: Webinar Date:
상품명: ANSYS Fluent, ANSYS Meshing


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ANSYS Forteを使用したフルサイクルGDIエンジンのシミュレーション (ウェビナー)

本ウェビナーでは、ANSYS Forteを使用したフルサイクルGDIエンジンのシミュレーションのセットアップにおけるコツやヒントなどを紹介し、さらにANSYS EnSightでシミュレーション結果を可視化する方法について説明します。

저자: ANSYS, Inc. 형식: Webinar Date:
상품명: ANSYS Forte, ANSYS EnSight
산업: Automotive


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Cummins’ View on Speed and Agility Enabled by High Performance Computing

Attend this webinar to learn how you can reduce simulation time on increasingly complex engineering challenges in today’s fast-paced globalized economy by incorporating high-performance computing (HPC) into your virtual product development.

Guest speaker Mike Hughes, who is the program director, digital engineering/transformation at Cummins Inc., will outline a credible path to the HPC power needed for ever-expanding engineering simulation demands. The views of solution provider Dell Technologies, who along with X-ISS provide an end-to-end HPC solution for ANSYS workloads, will also be presented.

저자: ANSYS Inc. 형식: Webinar Date:
제품 카테고리: Platform


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An Automated Method for Using FEA to Identify PTHs and Microvias at Failure Risk

Plated through-holes (PTHs) and vias are widely deployed across the electronics industry for their ability to interconnect signal circuits at different printed circuit board (PCB) layers. But for many designers and engineers, vias and PTHs are sources of concern and difficulty when it comes to reliability: They are frequently the cause of open circuits on PCBs. Traditionally, the inconsistency of plating quality across manufacturers and the lack of robust material characterization make it challenging to develop models capable of predicting the reliability and manufacturability of these interconnects.

In this webinar, we will discuss the reliability challenges inherent in the utilization of PTHs and microvias. You will learn a methodology to analyze tens of thousands of interconnects on a PCB — and identify which are likely to fail — by simulating them under thermal loading using fine element modeling (FEM) and performing manufacturability and reliability analyses.

저자: ANSYS, Inc. 형식: Webinar Date:
상품명: ANSYS Sherlock
제품 카테고리: Structures


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Battery Failure Analysis

A manufacturer of communication equipment supplied a client with tens of thousands of devices. The client began experiencing issues, reporting scores of thermal events and hundreds of field failures. The device supplier turned to ANSYS-DfR Solutions to investigate the root cause of the field failures and for corrective actions.

저자: 형식: Case Study Date:


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ANSYS のマルチフィジックスによる仮想プロトタイピング (ウェビナー)

本ウェビナーでは、仮想プロトタイピングとその意味、マルチフィジックスシミュレーションについて説明し、さらに、ANSYSによるマルチフィジックスシミュレーションについて具体的な事例を交えながら紹介します。

저자: ANSYS, Inc. 형식: Webinar Date:
제품 카테고리: Multiphysics


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