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Accelerate Innovation with HPC-enabled Simulation

Together, Dell EMC, ANSYS, Intel® and OCF have developed an integrated and customizable solution that bridges the technology gap between workstations and full-scale HPC clusters. It’s accessible to smaller businesses and accelerates manufacturing workloads, reduces time to production and lowers system costs.

This comprehensive, scalable solution is customized to fit your specific ANSYS workload requirements. Integrating everything your business needs, including ANSYS job management software as well as services, the Dell EMC Optimized Platform for ANSYS Workloads deploys fast and starts working for your business right out of the box.

저자: 형식: Application Brief Date:
제품 카테고리: Cloud and IT Solutions
하위 산업: Computer and Storage Devices


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制造业材料知识共享领域最尖端解决方案⸺企业材料数据智能管理

GRANTA MI能够将可靠的材料数据与高层研究人员所拥有的材料知识、信息、经验结合,构建具有竞争力的材料数据库。GRANTA MI有助于避免浪费材料研发投资,并可缩短研发时间,GRANTA MI还能够实现素材的可视化对比分析,帮助客户准确挑选出重要的材料数据。针对客户的不同业务需求,GRANTA MI可提供最佳模型,为企业的整体优化和相关决策的有效制定提供帮助。例如,平衡产品性能和实现成本最优化,并兼顾考量环保法规的有关风险。

저자: 형식: Brochure Date:


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ANSYS Granta MDS用于仿真的材料数据管理

从ANSYS Mechanical中可轻松访问用于仿真的材料数据,即GrantaMDS模块,覆盖广泛的材料类型。新数据集来自行业标准的材料数据库,能提供结构分析所需的材料属性数据。

저자: 형식: Brochure Date:


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GRANTA Selector产品介绍

利用GRANTA Selector可以更智能地帮助客户选择和决定材料类型,它是一款针对材料选择和材料特性实现可视化的行业标准软件工具。

저자: 형식: Brochure Date:


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Smart Shape Optimization Using the Adjoint Solver

Learn about the easy-to-use, timesaving design tools for adjoint-based shape optimization in ANSYS Fluent. In the webinar, we introduce a workflow with increased convergence speeds and automation for optimizing the following applications:

  • Turbomachinery
  • Heat transfer
  • Internal flows
  • External aerodynamics

Presenter: Frank Kelecy

저자: ANSYS, Inc. 형식: Webinar Date:
상품명: ANSYS Fluent
제품 카테고리: Fluids


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ANSYS 2019 R3: Additive Manufacturing Update

The latest release of ANSYS additive manufacturing (AM) software includes these new features, among others:

  • ANSYS Additive Prep has a new build processor which allows you to export a build file directly to an AM machine.
  • ANSYS Workbench Additive enables you to switch easily between viewing the STL supports, mesh or element densities. It also features an option to remove STL supports after cooldown on the AM process sequencer.

ANSYS Additive Print also has multiple new features with regards to supports:

  • Support-only cutoff enables you to cut the support from the part but leaves the part attached to the baseplate under the displacement after cutoff output option.
  • The Support Groups feature enables multiple supports in a single simulation, including a mix of volume-less and solid support types.

Join us to learn about these new AM capabilities from ANSYS.

저자: ANSYS, Inc. 형식: Webinar Date:
상품명: ANSYS Additive Prep, ANSYS Additive Print, ANSYS Additive Suite
제품 카테고리: Structures


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Cloud Computing for ANSYS Electromagnetic Designs

Connecting to ANSYS Cloud enables organizations to implement high-fidelity simulations much faster in high-performance computing (HPC) environments than in local machines/datacenters. Users can submit simulation jobs for ANSYS electromagnetic tools such as ANSYS HFSS, ANSYS SIwave, ANSYS Maxwell and ANSYS Q3D Extractor from the ANSYS Electronics Desktop to the Microsoft Azure hosted ANSYS Cloud. Read this application brief to learn about the details and benefits of running EM simulations in ANSYS Cloud.

저자: ANSYS, Inc. 형식: Application Brief Date:
상품명: ANSYS Cloud, ANSYS HFSS, ANSYS Maxwell, ANSYS Q3D Extractor, ANSYS SIwave
제품 카테고리: Electronics


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Challenges and Trends in SoC Electromagnetic (EM) Crosstalk

Electromagnetic Crosstalk analysis is emerging as a fundamental necessity as a component of electronic system development. With the advent of advanced technologies and System on-Chip (SoC) architectures, ignoring electromagnetic crosstalk is highly risky resulting in significant delays in reaching the market on time as well significant cost over runs. This paper provides an overview of the state of the practice in electromagnetic crosstalk in the context of modern SoC designs, current industrial trends, and key adoption challenges.

저자: ANSYS, Inc. 형식: White Paper Date:
상품명: ANSYS RaptorX, ANSYS Pharos, ANSYS Exalto, ANSYS VeloceRF
제품 카테고리: Semiconductors


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De-Risking High-Speed Serial Links from On-Chip Electromagnetic Crosstalk and Power Distribution Issues

High speed/frequency RF transceivers and SoCs for 5G, mobile, AI, automotive and networking applications are becoming increasingly susceptible to electromagnetic (EM) cross coupling effects. Learn how ANSYS on-chip EM solutions can accurately capture all electromagnetic phenomena for mitigating the risk of electromagnetic crosstalk-induced performance degradation and failure in high-speed, high-frequency and low-power RFICs and SoCs. See how NVIDIA applies ANSYS EM tools to address high-speed serial link design challenges that come with denser routings and aggressive floorplans, including on-chip EM crosstalk and large di/dt induced supply noise.

Presenters:

Dai Dai, Mixed Signal Design Manager, NVIDIA
Dai Dai received his B.S. degree from Tsinghua University, Beijing, China in 2010 and M.S. degree from the University of California, Los Angeles, in 2012, both in electrical engineering. He has been with Nvidia since 2013, where he is currently a Mixed-Signal Design Manager with the high-speed wireline team. His research interests include high-speed serial I/O transceiver designs, PLLs and data converters.

Yorgos Koutsoyannopoulos, Vice President, Engineering, ANSYS
Experienced Chief Executive Officer with a demonstrated history in the EDA and semiconductor industry. Strong business development professional skilled in entrepreneurship, enterprise software sales, EDA, semiconductors, management, startups and international transactions.

저자: ANSYS, inc. 형식: Webinar Date:
제품 카테고리: Electronics - High Frequency Electromagnetics
하위 산업: Semiconductors


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Antenna Optimization and Design Placement with ANSYS HFSS

Whether you are supporting innovative wireless applications in IoT or 5G, or creating antennas for custom applications for medical, military or industrial use, ANSYS HFSS can be an incredibly powerful tool. Design engineers must consider the wider implications of a fully integrated system, and not judge success solely on the performance of a single system. Design teams must wait for a viable prototype to be built and tested prior to full integration assessment. As this is typically very late in the design stage, it is also a very costly time to expose flaws in the design. Learn how virtual prototyping can identify and correct issues early in the antenna design process with HFSS.

저자: ANSYS, Inc. 형식: Webinar Date:
상품명: ANSYS HFSS
제품 카테고리: Electronics


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