3D-IC Foundry Frameworks
Join us on June 28th; Ansys R&D members will discuss an overview of the 3D-IC technology development frameworks offered by TSMC, Samsung, and Intel and how Ansys simulation tools and workflows fit into those frameworks.
產品系列
檢視所有產品Ansys 致力於提供免費的模擬工程軟體給學生,以協助當今的學生獲得傑出的表現。
Join us on June 28th; Ansys R&D members will discuss an overview of the 3D-IC technology development frameworks offered by TSMC, Samsung, and Intel and how Ansys simulation tools and workflows fit into those frameworks.
Time:
June 28, 2023
11 AM EST
Venue:
Virtual
Semiconductor applications such as Mobile (5G), Automotive, and Datacenter (HPC, AI) demand better scaling, performance, and lower power usage. Advanced packaging is moving towards 3DIC systems to address these needs, as evidenced by the technology directions from TSMC, Samsung, and Intel. We'll present a comprehensive overview of these technologies, and the Ansys flows to address EMIR, Thermal integrity, and mechanical stress challenges posed by these 3DIC systems.