Modern multi-die packages with 2.5D interposers or 3D stacking technology assemble complex integrated systems that are tightly coupled across a range of physics, including power integrity, signal integrity, thermal and mechanical stress/warpage. The only way to accurately predict the overall behavior of these systems is with a unified analysis environment that brings together market-leading engines from multiple tools into a simultaneous multiphysics solution.
RedHawk-SC Electrothermal lowers design time and design risk with integrated access to Ansys analysis algorithms, from industry-leading chip, board and system-level tools across multiple disciplines. Its range is unmatched by any other product.
This has led major foundries to certify RedHawk-SC Electrothermal as a signoff solution for their multi-die packaging technologies.
Its high capacity and silicon-correlated accuracy not only reduces risk but also allows reduced safety margins, which leads to significant reductions in power and higher performing designs.