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Ansys 2023 R2: Ansys HFSS, SIwave, and Q3D What’s New

The 2023 R2 update for Ansys High Frequency Electronics products is enormous. In this webinar, you’ll learn about new capabilities in HFSS for 3D Layout that bolsters electromagnetic simulation support for IC design and antenna modeling in large platforms, multiple power and thermal improvements for SIwave, and new solver and electrothermal capabilities in Q3D.


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About this Webinar

The 2023 R2 update to Ansys High Frequency Electronics products includes updates to HFSS that bolster IC Design electromagnetic simulation support, electrothermal flow enhancements for SIwave and Q3D, and more.

What You Will Learn

During this presentation, you'll learn about the following:


  • Integrations of Q3D and Raptor-X with HFSS 3D Layout
  • 3D component array with platform geometries
  • HPC scalable distributed adaptive refinement (Beta)


  • New electrothermal flow for power electronics
  • DC power tree export enhancements
  • CPA Thermal aware package model extraction 


  • New electrothermal flow for power electronics
  • Scalable AC-RL solver for extensive packages
  • Improvements to distributed memory capacitance extraction solver

Who Should Attend

All users of Q3D Extractor, SIwave and HFSS



Juliano Mologni is our SI/PI and EMI/EMC Product Manager. He has over 20 years of experience in computational electromagnetics and is the author of multiple patents and more than 60 journal and conference papers. Juliano's involvement includes RF and EMC projects with top Automotive, A&D, Appliances, and High-Tech companies. He holds a BSc degree in Telecommunication Engineering, an MSc degree in Microelectronics, and authored a Ph.D. thesis on Automotive EMC and Signal Integrity.