Ansys 2022 R1: Ansys Icepak Update
Ansys Icepak brings new capabilities in the areas of chip/package co-design, advanced blower modeling, and structural impact on electrical designs.
Register Now
About this Webinar
Join us as we explore the new product updates for Ansys Icepak and Ansys Mechanical in Ansys Electronics Desktop. We enhanced our integrated platform for combined electrical and thermal design and added new capabilities in chip/package co-design, advanced blower modeling, and structural impact on electrical designs. We'll also share recent meshing quality and robustness improvements for Icepak and Mechanical.
What Attendees Will Learn
- How thermal packaging engineers work closely with chip designers to achieve better thermal management designs
- How Ansys delivers tighter integration between electrical, thermal, and structural domains, allowing for design trade-offs earlier in the process
- Easy ways to add complex blower components to Icepak designs
Speaker
Jim Delap is the Director of electronics product management at Ansys. After his master's from the University of Virginia, he worked in the microwave and RF community for over 25 years, specializing in high-frequency and millimeter-wave IC and module design, emphasizing thermal and electromagnetic effects in ICs and packages.
Ansys가 귀사를 위해 무엇을 할 수 있는지 알아보십시오.
Ansys가 귀사를 위해 무엇을 할 수 있는지 알아보십시오.
Contact Us
문의하기
