This webinar showcases Ansys SIwave’s significant simulation improvements for electronic printed circuit boards and IC packages in the new 2021 R2 release.
Time:
August 5, 2021
11 AM EDT / 4 PM BST / 8:30 PM IST
Venue:
Online
The 2021 R2 Signal and Power Integrity release introduces significant simulation improvements for electronic printed circuit boards and IC packages. Ansys SIwave delivers new features, including support for temperature-dependent materials in AC solver and an updated thermal link between Ansys Icepak and Ansys Electronics Desktop. Additionally, SI Xplorer will help PCB designers define stackup and optimize transitions such as vias.
This webinar spotlights substantial advancements in SIwave.
