Ansys 2022 R1: Ansys Icepak Update
Ansys Icepak brings new capabilities in the areas of chip/package co-design, advanced blower modeling, and structural impact on electrical designs.
Join us as we explore the new product updates for Ansys Icepak and Ansys Mechanical in Ansys Electronics Desktop. We enhanced our integrated platform for combined electrical and thermal design and added new capabilities in chip/package co-design, advanced blower modeling, and structural impact on electrical designs. We'll also share recent meshing quality and robustness improvements for Icepak and Mechanical.
Jim Delap is the Director of electronics product management at Ansys. After his master's from the University of Virginia, he worked in the microwave and RF community for over 25 years, specializing in high-frequency and millimeter-wave IC and module design, emphasizing thermal and electromagnetic effects in ICs and packages.