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Ansys Q3D Extractor
Multiphysics Parasitic Extraction & Analysis

Ansys Q3D Extractor efficiently performs the 3D and 2D quasi-static electromagnetic field simulations required for the extraction of RLCG parameters from an interconnect structure.

A Parasitic Extraction Tool for Modern Electronics Design

Ansys Q3D Extractor calculates the parasitic parameter of frequency-dependent resistance, inductance, capacitance and conductance (RLCG) for electronic products. Q3D Extractor is ideal for designing advanced electronics packages and connectors used in high-speed electronic equipment. It is also used for high-power bus bars and power converter components used in electrical power distribution, power electronics and electric drive systems.

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    Solid Modelling
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    Various Extraction Types
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    Power/Signal Integrity Analysis
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    Automatic, Adaptive Mesh Refinement
electronics inverter power

Churning Wind into Power

Learn how Ansys Q3D Extractor aids in the design of an efficient wind turbine generator.

Churning Wind into Power

Engineers who design wind turbines face a significant challenge: to accurately determine specifications of various individual components — which often originate from different manufacturers — and then connect them into an efficient system.

Without using simulation tools, it is almost impossible to determine the performance of a complex heterogeneous system, such as a wind turbine, that incorporates the high efficiency requirements needed for the electrical system. The heart of the ANSYS solution methodology for electromechanical systems is ANSYS Simplorer software. Using this technology, the engineer can set up a complex system entirely using analytical models.

By employing detailed finite element method (FEM) models and a broad set of ANSYS simulation tools, users have the capability to analyze, optimize and embed all components in the overall end-to-end system. Many design requirements for these electrical systems are complex and can be determined only via simulation. These include network coupling design and integration of power control based on existing electrical generator characteristics, as well as admissible power fluctuations and/or suppression of harmonics.

Q3D CAPABILITIES

Understand parasitic parameters of frequency-dependent resistance, inductance, capacitance and conductance

Ansys Q3D Extractor is ideal for designing advanced electronics packages and connectors used in high-speed electronic equipment, or the high-power bus bars and power converter components used in electrical power distribution, power electronics and electric drive systems.

Ansys Q3D Extractor efficiently performs the 3D and 2D quasi-static electromagnetic field simulations required for the extraction of RLCG parameters from an interconnect structure to automatically generate an equivalent SPICE model. These highly accurate models can be used to perform signal integrity analysis to study electromagnetic phenomena to understand the performance of interconnects, IC packages, connectors, PCBs, bus bars and cables.

 

Key Features

ANSYS Q3D Extractor simulation and analysis technology enables you to predict that your products will thrive in the real world.

3D Quasi-static Field Solver

Ansys Q3D Extractor contains an advanced quasi-static 3D electromagnetic field solver based on the method of moments (MoM), and is accelerated by the fast multipole method (FMM). Results include proximity and skin effect, dielectric and ohmic loss, and frequency dependencies. Q3D Extractor easily and quickly provides 3D extraction of resistance (R), partial inductance (L), capacitance (C) and conductance (G).

2D Extractor: Cable and Transmission Line Field Solver

Ansys Q3D Extractor includes a powerful quasi-static 2D electromagnetic field solver that uses the finite element method (FEM) to determine the per-unit-length RLCG parameters for cable models, transmission lines, characteristic impedance (Z0) matrices, propagation speed, delay, attenuation, effective permittivity, differential and common-mode parameters, and near- and far-end crosstalk coefficients

Automatic adaptive meshing techniques require you to specify only geometry, material properties and the desired output. The meshing process uses a highly robust volumetric meshing technique and includes a multithreading capability that reduces the amount of memory used and accelerates time to simulation. This proven technology eliminates the complexity of building and refining a finite element mesh and makes advanced numerical analysis practical for all levels of your organization.

Multithreading: Electronics HPC takes advantage of multiple cores on a single computer to reduce solution time. Multithreading technology speeds up the initial mesh generation, matrix solves and field recovery.

Spectral Decomposition Method: The spectral decomposition method (SDM) accelerates frequency sweeps by distributing multiple frequency points in parallel over compute cores and nodes. You can use this method in tandem with multithreading to speed up extraction of individual frequency points, while SDM parallelizes multifrequency point extraction.

HPC in the Cloud: Ansys Cloud makes high-performance computing (HPC) extremely easy to access and use. It was developed in collaboration with Microsoft® Azure™, a leading cloud platform for HPC. Ansys Cloud has been integrated into Ansys Electronics Desktop, so you can access unlimited, on-demand computing power directly from the design environment. For more information visit the Ansys Cloud page.

Parametric analysis

  • User-specified range and number of steps for parameters
  • Automatic analysis of parameter permutations
  • Automated job management across multiple hardware platforms and reassembly of data for parametric tables and studies

Optimization

  • User-selectable cost functions and goal objectives, including:
  • Quasi-Newton method
  • Sequential nonlinear programming (SNLP)
  • Integer-only sequential nonlinear programming

Simplorer is a powerful platform for modeling, simulating and analyzing system-level digital prototypes integrated with Ansys Maxwell, Ansys HFSS, Ansys SIwave, and Ansys Q3D Extractor. Simplorer enables you to verify and optimize the performance of your software-controlled, multidomain systems. With flexible modeling capabilities and tight integration with Ansys 3D physics simulation, Simplorer provides broad support for assembling and simulating system-level physical models to help you connect conceptual design, detailed analysis and system verification.

Simplorer is ideal for electrified system design, power generation, conversion, storage and distribution applications, EMI/EMC studies and general multidomain system optimization and verification.

The ability to generate highly accurate reduced-order SPICE models for use in circuit simulation makes Ansys Q3D Extractor the ideal software to create IBIS package models. You can study crosstalk, ground bounce, interconnect delays and ringing, which helps you to understand the performance of high-speed electronic designs, such as multilayer printed circuit boards, advanced electronic packages and 3D on-chip passive components. In addition, Q3D Extractor is essential for extracting accurate electrical parasitics of critical interconnect components in the package (bondwires), on the board (critical nets), and for the connection path between the chip, package and board (i.e., connectors, cables, sockets and transmission lines).

You can leverage Ansys Q3D Extractor to create equivalent circuit models (SPICE subcircuits/ladder-type lumped models). The type of model that Q3D Extractor produces depends on which solver was used. The 2D and 3D field solvers create common formats such as Simplorer SML, HSPICE Tabular W-Element, PSpice, Spectre, IBIS ICM/PKG models and Ansys CPP models.

Ansys Q3D Extractor is ideal for designing power electronic equipment used in hybrid-electric technologies and power distribution applications to optimize inverter/converter architectures and minimize bus inductance, overvoltage situations and short-circuit currents. The software extracts resistance, partial inductance and capacitance parasitics from high-power bus bars, cables, and high-power inverter/converter modules, then inputs them into Ansys Twin Builder to study the EMI/EMC performance of a power electronic system. Links to Ansys Icepak and Ansys Mechanical enable you to study electrothermal stresses caused by electrical currents.

With Q3D Extractor, you can solve design challenges by analyzing the RLCG matrix data of touchscreen devices. The ability to efficiently solve thin conductive layers, such as ITO, can accelerate solutions up to 22 times over traditional thick metal solution methods.

Q3D RESOURCES & EVENTS


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