Software Solutions for PCB Design and Simulation
Ansys offers a complete, most powerful, accurate and scalable simulation solution for printed circuit boards (PCBs), integrated circuits (ICs), and IC Packages for accurate evaluation of an entire system.
ANSYS APPLICATIONS
PCB Board Modeling and Simulation
Printed circuit boards (PCBs), ICs and IC packages are used in almost all electronic products across all industries: automotive, A&D, consumer electronics, healthcare and energy. With electronics getting smaller, engineers need to design boards that are smaller than ever and incorporate all the required features. Accurate modeling and simulation of these components are key to reliable end products.
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SI, PI and EMI Analysis
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Electrothermal Analysis
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Shock and Vibration Analysis
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Reliability Prediction
Signal and Power Integrity
Ansys signal integrity (SI) analysis products are essential for designing the high-speed serial channels, parallel buses and complete power delivery systems found in modern high-speed electronic devices. These integrated electromagnetics (EM) and circuit simulation tools predict EMI/EMC, power integrity and SI issues, resulting in optimized system performance prior to the build-and-test process.
Thermal Mechanical Stresses
The potential for failure in electronic systems due to thermal and mechanical loading of printed circuit boards (PCBs) is escalating due to steadily increasing power dissipation, combined with smaller board sizes. Learn how to prevent PCB failures due to thermal and mechanical stresses.
Electromagnetic Interference
It is not uncommon to have a design fail in the field due to signal integrity issues, even though simulation shows it should work perfectly, because the as-manufactured product differs from the design definition. To avoid this problem, the signal integrity engineer needs to understand what will be delivered and use simulation to verify that the frequency- and time-domain performance will meet the design requirements.
Electronics Reliability
Ensuring electronics reliability is a multi-pronged effort, involving selection, optimization and design rules. But, at the end of the day, almost every organization needs a reliability prediction. How long before the product fails and how will it fail?
Featured Products
Ansys HFSS
ElectronicsA 3D electromagnetic field solver to design high-frequency and high-speed electronic components. Its FEM, IE, asymptotic and hybrid solvers address RF, microwave, IC, PCB and EMI problems.
- Solves multi-layer packages
- 3D layout workflow for PCBs and packages
- High-frequency electromagnetic solvers
- IP protection through 3D components
Ansys Slwave
ElectronicsA specialized tool for simulating power and signal integrity as well as EMI analysis of IC/PCB packages. Solve for power delivery systems and high-speed channels in electronic devices.
- Electrothermal and mechanical analysis
- IBIS and IBIS-AMI SerDes analysis
- Virtual compliance
- Impedance, crosstalk and EMI scanning
- Automated decoupling capacitor Optimization
Icepak
ElectronicsA computational fluid dynamics (CFD) solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies, enclosures and power electronics.
- Unstructured, body-fitted meshing
- Built-in high-fidelity CFD solver
- Comprehensive thermal reliability solution
- Industry leading multiscale multiphysics
- Board-level electrothermal coupling
- Extensive libraries for thermal physics
Ansys Q3D Extractor calculates the parasitic parameter of frequency-dependent resistance, inductance, capacitance and conductance (RLCG) for electronic products.
- Solid modeling
- Power/signal integrity analysis
- Various extraction types
- Automatic, adaptive mesh refinement
Provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early design stages to help future-proof your design.
- Solder fatigue analysis
- Translates ECAD to FEA/CFD in minutes
- Turns stress (thermal, mechanical) into life prediction
- Embedded, populated, modifiable libraries
- Validated time-to-failure predictions
- Electromagnetic on-silicon modeling
- Includes gold standard HFSS engine
- High-capacity and linear multi-CPU scalability
- S-param and RCLk parasitic extraction
- Models power grids, clock trees, spirals, MiM/MoM caps, etc.
- Foundry certified and silicon correlated
- Identifies nets susceptible to electromagnetic (EM) crosstalk
- Includes substrate coupling
- Ranks EM aggressors per victim net
- SoC and large block capacity
- What-if capability with point-and-click GUI
- RLCk signoff extraction tool (post-LVS)
- Models electrical, magnetic and substrate coupling
- Highly reduced lumped-element models
- Complements digital RC extractors
- Extract entire SoC power grid in minutes
- What-if capability with point-and-click GUI
- Golden IR-drop signoff verification for digital designs
- Electromigration reliability signoff
- Timing impact of IR-drop
- High-capacity cloud-native infrastructure
- AI/ML interface included
- Foundry certified for all finFET to 3nm
- Power integrity and noise verification at transistor level
- Capacity for several million xtor flat
- Simultaneous simulation of digital and analog blocks
- Abundant what-if scenarios
- Incremental analysis
- Creates IP power models for use with RedHawk-SC
- RTL design-for-power platform
- Analysis-driven power reduction
- Physical-aware RTL power budgeting
- Long vector profiling
- Direct links to hardware emulators
Continental Automotive chose Ansys Sherlock for its ability to quantify the changes in reliability of a component due to various system-level effects, including the thermomechanical influence of adhesives.
Featured Resources
WEBINARS
On Demand Webinar
Practical Ports for Perfect Performance
This webinar spotlights the theoretical basis of various port types and how to use them in real designs to deliver maximum accuracy.
On Demand Webinar
Ansys 2020 R2: Advancements in Ansys Slwave
This webinar delivers a deep dive into Ansys SIwave’s many significant advancements offered in Ansys 2020 R2.
On Demand Webinar
Electrical and Thermal Reliability Analysis of PCB with Ansys SIwave, Icepak, Mechanical and Sherlock
In this webinar, learn how Ansys SIwave, Ansys Icepak, Ansys Mechanical and Ansys Sherlock can be used as a comprehensive multi-physics solution to optimize PCB reliability.
CASE STUDIES
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了解Ansys提供的产品与服务
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