Software Solutions for PCB Design and Simulation
Ansys offers a complete, most powerful, accurate and scalable simulation solution for printed circuit boards (PCBs), integrated circuits (ICs), and IC Packages for accurate evaluation of an entire system.
ANSYS APPLICATIONS
PCB Board Modeling and Simulation
Printed circuit boards (PCBs), ICs and IC packages are used in almost all electronic products across all industries: automotive, A&D, consumer electronics, healthcare and energy. With electronics getting smaller, engineers need to design boards that are smaller than ever and incorporate all the required features. Accurate modeling and simulation of these components are key to reliable end products.
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SI, PI and EMI Analysis
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Electrothermal Analysis
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Shock and Vibration Analysis
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Reliability Prediction
Signal and Power Integrity
Ansys signal integrity (SI) analysis products are essential for designing the high-speed serial channels, parallel buses and complete power delivery systems found in modern high-speed electronic devices. These integrated electromagnetics (EM) and circuit simulation tools predict EMI/EMC, power integrity and SI issues, resulting in optimized system performance prior to the build-and-test process.
Thermal Mechanical Stresses
The potential for failure in electronic systems due to thermal and mechanical loading of printed circuit boards (PCBs) is escalating due to steadily increasing power dissipation, combined with smaller board sizes. Learn how to prevent PCB failures due to thermal and mechanical stresses.
Electromagnetic Interference
It is not uncommon to have a design fail in the field due to signal integrity issues, even though simulation shows it should work perfectly, because the as-manufactured product differs from the design definition. To avoid this problem, the signal integrity engineer needs to understand what will be delivered and use simulation to verify that the frequency- and time-domain performance will meet the design requirements.
Electronics Reliability
Ensuring electronics reliability is a multi-pronged effort, involving selection, optimization and design rules. But, at the end of the day, almost every organization needs a reliability prediction. How long before the product fails and how will it fail?
Featured Products
用于设计高频和高速电子元件的 3D 电磁场求解器。其 FEM、IE、渐近和混合求解器可解决 RF、微波、IC、PCB 和 EMI 问题。
- 解决多层封装
- PCB 和封装的 3D 布局工作流程
- 高频电磁求解器
- 通过 3D 组件进行 IP 保护
面向电源和信号完整性仿真以及IC/PCB封装EMI分析的专用工具。解决电子设备中的供电系统和高速通道。
- 电热和机械分析
- IBIS 和 IBIS-AMI SerDes 分析
- 虚拟合规 阻抗、串扰和EMI扫描
- 自动解耦电容器优化
用于电子热管理的计算流体动力学（CFD）求解器。它可以预测IC封装、PCB、电子装配体、外壳和电力电子设备中的气流、温度和热传递。
- 非结构化、贴体网格划分
- 内置高保真度CFD求解器
- 综合全面的热可靠性解决方案
- 行业领先的多尺度多物理场
- 板级电热耦合
- 丰富的热物理库
Ansys Q3D Extractor可计算电子产品与频率相关的电阻、电感、电容和电导（RLCG）的寄生参数。
- 实体建模
- 电源/信号完整性分析
- 多种提取类型
- 自动自适应网格优化
在设计早期阶段，在组件、板级和系统层面为电子产品硬件提供快速准确的使用寿命预测，有助于实现面向未来的设计。
- 焊接疲劳分析
- 在几分钟内完成ECAD到FEA/CFD的转换
- 将应力（热、机械）转化为寿命预测
- 嵌入式、可填充、可修改的库
- 经过验证的故障时间预测
- Electromagnetic on-silicon modeling
- Includes gold standard HFSS engine
- High-capacity and linear multi-CPU scalability
- S-param and RCLk parasitic extraction
- Models power grids, clock trees, spirals, MiM/MoM caps, etc.
- Foundry certified and silicon correlated
- RLCk signoff extraction tool (post-LVS)
- Models electrical, magnetic and substrate coupling
- Highly reduced lumped-element models
- Complements digital RC extractors
- Extract entire SoC power grid in minutes
- What-if capability with point-and-click GUI
- Golden IR-drop signoff verification for digital designs
- Electromigration reliability signoff
- Timing impact of dynamic voltage drop aggressors
- High-capacity cloud-native infrastructure
- Advanced power analytics and build quality metric
- Foundry certified for all finFET to 3nm
- Power integrity and noise verification at transistor level
- Totem-SC offers an ultra high-capacity version of Totem
- Capacity for several million xtor flat
- Simultaneous simulation of digital and analog blocks
- Abundant what-if scenarios
- Incremental analysis
- Creates IP power models for use with RedHawk-SC
- RTL design-for-power platform
- Analysis-driven power reduction
- Physically-aware RTL power budgeting
- Long vector profiling
- Direct links to hardware emulators
Continental Automotive chose Ansys Sherlock for its ability to quantify the changes in reliability of a component due to various system-level effects, including the thermomechanical influence of adhesives.
Featured Resources
WEBINARS
On Demand Webinar
Practical Ports for Perfect Performance
This webinar spotlights the theoretical basis of various port types and how to use them in real designs to deliver maximum accuracy.
On Demand Webinar
Ansys 2020 R2: Advancements in Ansys Slwave
This webinar delivers a deep dive into Ansys SIwave’s many significant advancements offered in Ansys 2020 R2.
On Demand Webinar
Electrical and Thermal Reliability Analysis of PCB with Ansys SIwave, Icepak, Mechanical and Sherlock
In this webinar, learn how Ansys SIwave, Ansys Icepak, Ansys Mechanical and Ansys Sherlock can be used as a comprehensive multi-physics solution to optimize PCB reliability.
CASE STUDIES
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