Skip to Main Content

Webinar

Ansys Icepak and Sherlock For Temperature Cycling

This webinar will demonstrate an automated process of thermal modeling of printed circuit boards. It will present a workflow to translate ECAD data to a thermal and mechanical model in Ansys Icepak, followed by the transfer of results into Ansys Sherlock for solder fatigue analysis.

 

SHARE THIS WEBINAR

准备好让不可能成为可能了吗?

联系我们

* = 必填项

感谢您的联系!

We’re here to answer your questions and look forward to speaking with you. A member of our Ansys sales team will contact you shortly.

Racecars on a track