Skip to Main Content

 

White Paper

Failure Modes in Conductive Adhesives

By Petri Savolainen

Conductive adhesives offer lead-free, low temperature attachment for various types of electronics applications. They are composite materials consisting of a polymer matrix (adhesion, strength) and conductive filler (electric conductivity). Due to the nature of polymers, it is relatively easy to tailor adhesive properties to match specific requirements. Selection of the filler depends on the application.

SHARE THIS TECHNICAL PAPER

Erfahren Sie, wie Ansys Ihnen helfen kann

KONTAKT

* = Pflichtfeld

Danke für die Kontaktaufnahme

We’re here to answer your questions and look forward to speaking with you. A member of our Ansys sales team will contact you shortly.

Fußzeilenbild