Skip to Main Content

 

White Paper

Failure Modes in Conductive Adhesives

By Petri Savolainen

Conductive adhesives offer lead-free, low temperature attachment for various types of electronics applications. They are composite materials consisting of a polymer matrix (adhesion, strength) and conductive filler (electric conductivity). Due to the nature of polymers, it is relatively easy to tailor adhesive properties to match specific requirements. Selection of the filler depends on the application.

SHARE THIS TECHNICAL PAPER

See What Ansys Can Do For You

Contact us today

* = Required Field

Thank you for reaching out!

We’re here to answer your questions and look forward to speaking with you. A member of our Ansys sales team will contact you shortly.

Footer Image