Ansys Sherlock
Reliability Engineering Software: Free Trial
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Get time-to-failure life predictions at the component, board and system levels in early design stages with Ansys Sherlock
Ansys Sherlock automated design analysis software is the only reliability physics-based engineering simulation software that provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early design stages. Features include:
- Translating ECAD to FEA in minutes
- Predicting time-to-failure for an entire PCBA, down to each component and connection
- Turning stresses (electrical, thermal and mechanical) into a prediction of product lifetime
- Integrating seamlessly with Ansys Workbench, Ansys Icepak and Ansys Mechanical
Sherlock is a reliability engineering software solution that builds on the information produced by CAE tools to provide the time-to-failure predictions needed to make design cost decisions. It reduces time-to-market by eliminating physical prototyping and testing.
No FEA Expertise Needed
Try Sherlock today to learn how mechanical, electrical and reliability engineers can seamlessly import complex 3D objects into one tool and gain valuable insight into how mechanical structures — including enclosures, batteries, thermal solutions, chassis, displays and stiffeners — affect the robustness of electronics exposed to thermal and mechanical loads.
Featured Resources
On Demand Webinar
Implementing Reliability Physics into the Design Process: What Every Manager and Engineer Needs to Know
Learn how Ansys Sherlock reliability analysis helps predict deficiencies early evaluate what-if scenarios and determine lifecycle reliability in your automotive electronic PCB systems.
On Demand Webinar
Reliability of Microvias/Plated Through-Holes in PCB
This webinar provides a new, fully automated approach to analyze complex PCB designs and identify the configurations that are susceptible to failure.
On Demand Webinar
The Reliability of BGAs, QFNs and Other Critical Packages
This presentation discusses the critical parameters of these packages that may affect the thermal cycling performance.
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